Solid-state semiconductor light emitting device

A solid-state semiconductor light emitting device comprising:

• a heat sink having a receiving cup that projects from a center of said heat sink for receiving a chip;
• and
• a leadframe, in which two holders having two top sides on two top portions thereof are opposite to one another and a holder having holes is mounted between said two top sides, wherein said holder having said holes is connected to one of said two opposite holders, and a plastic material is applied to mold said three holders into a connection base for receiving said receiving cup of said heat sink;
• thereby said chip is connected to said leadframe via a metal wire and a resin or silicone are applied to cover all of them so as to form said solid-state semiconductor light emitting device that has good heat-dissipating efficacy and can enhance connection stability,
• wherein a protrusion is mounted on said bottom surface of said heat sink.

A solid-state semiconductor light emitting device comprising:

• a heat sink having a receiving cup that projects from a center of said heat sink for receiving a chip;
• and
• a leadframe, in which two holders having two top sides on two top portions thereof are opposite to one another and a holder having holes is mounted between said two top sides, wherein said holder having said holes is connected to one of said two opposite holders, and a plastic material is applied to mold said three holders into a connection base for receiving said receiving cup of said heat sink;
• thereby said chip is connected to said leadframe via a metal wire and a resin or silicone are applied to cover all of them so as to form said solid-state semiconductor light emitting device that has good heat-dissipating efficacy and can enhance connection stability,
• wherein said holder having said holes is connected to one of said two opposite holders in a random position.