Method of manufacturing semiconductor apparatus

A test apparatus of a semiconductor apparatus, comprising:

• a substrate provided with a projection formed on one main surface of said substrate so as to be electrically connectable to an electrode of a tested semiconductor apparatus;
• a pad formed on a back surface side of said one main surface;
• and
• a conductive member electrically connecting said projection and said pad,
• wherein a region of said substrate where the projection is formed is deformed more easily than a region apart therefrom;
• and further comprising:
• a second plate member arranged so as to oppose to the surface of said substrate where the pad is formed, and provided with a wire electrically communicated with said pad;
• and
• a third plate member arranged between said substrate and said second plate member,
• wherein said third plate member is formed of a material having a Young's modulus of 60 GPa or more, and has a thickness of 100 μm or more.

A test apparatus of a semiconductor apparatus, comprising:

• a substrate provided with a projection formed on one main surface of said substrate so as to be electrically connectable to an electrode of a tested semiconductor apparatus, wherein said substrate is made of silicon;
• a pad formed on a back surface side of said one main surface;
• and
• a conductive member electrically connecting said projection and said pad,
• wherein a region of said substrate where the projection is formed is deformed more easily than a region apart therefrom;
• and
• further comprising:
• a second plate member arranged so as to oppose to the surface of said substrate where the pad is formed, and provided with a wire electrically communicated with said pad;
• and
• a third plate member arranged between said substrate and said second plate member,
• wherein said third plate member is formed of a material having a Young's modulus of 60 GPa or more, and has a thickness of 100 μm or more.

A test apparatus of a semiconductor apparatus, comprising:

• a substrate provided with a projection formed on one main surface of said substrate so as to be electrically connectable to an electrode of a tested semiconductor apparatus, wherein said substrate is made of silicon;
• a pad formed on a back surface side of said one main surface;
• and
• a conductive member electrically connecting said projection and said pad,
• wherein a region of said substrate where the projection is formed is deformed more easily than a region apart therefrom, and
• wherein a plurality of said substrates are provided substantially within one surface.

A test apparatus of a semiconductor apparatus, comprising:

• a substrate provided with a projection formed on one main surface of said substrate so as to be electrically connectable to an electrode of a tested semiconductor apparatus, wherein said substrate is made of silicon, and wherein said projection is made of silicon integrated with said substrate, and has a conductive coat thereon;
• a pad formed on a back surface side of said one main surface;
• and
• a conductive member electrically connecting said projection and said pad,
• wherein a region of said substrate where the projection is formed is deformed more easily than a region apart therefrom.