Charged beam writing apparatus and writing method

A charged beam writing apparatus adopting a beam shaping system, comprising:

• a shaped beam forming unit which shapes a charged beam radiated from a charged beam source into a beam of a desired shape by using at least two shaping masks each having a shaping aperture to form a shaped beam;
• a figure dividing unit which divides a contour portion of a pattern to be formed on an object layer into a plurality of figure portions having a predetermined width;
• a writing unit which writes the figure portions of the contour portion by using a shaped beam of the predetermined width;
• and
• a focus control unit which performs focusing of the beam radiated from the charged beam source, by using a shaped beam having the same width as the shaped beam which is used in writing the figure portions of the contour portion by the writing unit.

A charged beam writing method comprising:

• shaping a charged beam radiated from a charged beam source into a beam of a desired shape by using at least two shaping masks each having a shaping aperture to form a shaped beam;
• dividing a contour portion of a pattern to be formed on an object layer into a plurality of figure portions having a predetermined area;
• and
• writing the figure portions of the contour portion by using a shaped beam of the predetermined area;
• the method further comprising:
• performing focusing of the beam radiated from the charged beam source in advance, before writing the pattern, by using a shaped beam having the same area as the shaped beam which is used in writing the figure portions of the contour portion.

A charged beam writing method comprising:

• shaping a charged beam radiated from a charged beam source into a beam of a desired shape by using at least two shaping masks each having a shaping aperture, and forming a shaped beam;
• dividing a contour portion of a pattern to be formed on an object layer into a plurality of figure portions having a predetermined width;
• and
• writing the figure portions of the contour portion by using a shaped beam of the predetermined width;
• the method further comprising:
• performing focusing of the beam radiated from the charged beam source in advance, before writing the pattern, by using a shaped beam having the same width as the shaped beam which is used in writing the figure portions of the contour portion.

A method of manufacturing a semiconductor device comprising:

• setting a supporting stage having a semiconductor substrate mounted thereon in a charged beam writing apparatus at a predetermined position thereof;
• dividing a contour portion of a pattern to be formed on the semiconductor substrate into a plurality of figure portions having a predetermined area;
• writing the figure portions of the contour portion on the semiconductor substrate, by using a shaped beam of a predetermined area formed by shaping a charged beam radiated from a charged beam source into a beam of a desired shape by using at least two shaping masks each having a shaping aperture;
• and processing the written pattern by using lithography and etching to form the pattern on the semiconductor substrate;
• the method further comprising:
• performing focusing of the beam radiated from the charged beam source in advance, before writing the pattern, by using a shaped beam having the same area as the shaped beam which is used in writing the figure portions of the contour portion.

A method of manufacturing a semiconductor device comprising:

• setting a supporting stage having a semiconductor substrate mounted thereon in a charged beam writing apparatus at a predetermined position thereof;
• dividing a contour portion of a pattern to be formed on the semiconductor substrate into a plurality of figure portions having a predetermined width;
• writing the figure portions of the contour portion on the semiconductor substrate, by using a shaped beam of a predetermined width formed by shaping a charged beam radiated from a charged beam source into a beam of a desired shape by using at least two shaping masks each having a shaping aperture;
• and
• processing the written pattern by using lithography and etching to form the pattern on the semiconductor substrate;
• the method further comprising:
• performing focusing of the beam radiated from the charged beam source in advance, before writing the pattern, by using a shaped beam having the same width as the shaped beam which is used in writing the figure portions of the contour portion.