Mechanical oscillator for wafer scan with spot beam

A scanning apparatus for processing a substrate, the scanning apparatus comprising:

• a base portion;
• and
• an oscillatory subsystem, comprising:
• a first link and a second link rigidly coupled to one another at a first joint, wherein the first link and second link are further rotatably coupled to the base portion by the first joint, therein defining a first axis of rotation,
• an end effector coupled to the first link and spaced a first distance from the first joint, wherein the substrate generally resides on the end effector;
• and
• a first actuator rigidly coupled to the base portion, wherein the second link is further coupled to the first actuator via at least a second joint, wherein the second joint is spaced a second distance from the first joint, and wherein the first actuator is operable to translate the second joint with respect to the base portion, therein rotating the first and second links about the first axis and translating the substrate along a first scan path.