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US 7,119,156 B2Granted
Resist resin
AssigneeKabushiki Kaisha Toshiba
InventorsTakeshi Okino, Koji Asakawa, Naomi Shida, Toru Ushirogouchi, Satoshi Saito
Life of this patent
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Abstract
According to the present invention, a resist resin having in its structure a specific bridged-bond-containing aliphatic ring, and a resist composition comprising the same are provided. By using this resist composition, a resist pattern excellent in both transparency against short-wavelength light and dry-etching resistance can be formed by alkali development with high resolution.
Claims4
A resin comprising a polymer compound produced by copolymerizing at least one monomer selected from monomers represented by the general formulas (I-1) and (I-2):
- wherein R is acryloyl or methacryloyl group, R11 and R12 are hydrogen atom or a monovalent alkyl group, with proviso that at least one of R11 and R12 is monovalent alkyl group, and R13 is OH group, ═O group, COOH group or COOR14 group, wherein R14 is a monovalent organic group, and at least one monomer selected from monomers represented by the general formulas (I-3), (I-4), (I-5), (I-6) and (I-7):
- wherein R is an acryloyl or methacryloyl group, R31 is hydrogen atom, or at least one group selected from the group consisting of OH group, OR14 group, wherein R14 is a monovalent organic group, and ═O group, R32 is hydrogen atom or a monovalent organic group, and R41 is vinyl, acryloyl or methacryloyl group.
Dependencies are inferred from the claim text.