Methods for making large dimension, flexible piezoelectric ceramic tapes

A method of producing a detection/test tape comprising:

• depositing a material onto a surface of at least one first substrate to form a plurality of element structures;
• depositing electrodes on a surface of each of the plurality of element structures;
• bonding the element structures to a second substrate, the second substrate being conductive or having a conductive layer and the second substrate being carried on a carrier plate;
• removing the at least one first substrate from the element structures;
• depositing second side electrodes on a second surface of each of the plurality of element structures;
• bonding a second side of the element structures to a third substrate, the third substrate being conductive or having a conductive layer, wherein at least one of the second substrate or the third substrate is at least one of flexible or partially flexible;
• and
• removing the carrier plate.

A method of producing a detection/test tape comprising:

• depositing a material onto a surface of at least one first substrate to form a plurality of element structures;
• depositing electrodes on a surface of each of the plurality of element structures;
• bonding the element structures to a second substrate, the second substrate being conductive or having a conductive layer and the second substrate being carried on carrier plate, wherein the step of bonding the element structures to the second substrate, includes the second substrate being a final target substrate, wherein the bond is intended to be permanent;
• removing the at least one first substrate from the element structures;
• depositing second side electrodes on a second surface of each of the plurality of element structures;
• bonding a second side of the element structures to a third substrate, the third substrate being conductive or having a conductive layer;
• and
• removing the carrier plate.

A method of producing a detection/test tape comprising:

• depositing a material onto a surface of at least one first substrate to form a plurality of element structures, wherein the element structures are made from one of piezoelectric or other functional ceramic, including at least one of antiferroelectric material, electrostrictive material, and magnetostrictive materials;
• depositing electrodes on a surface of each of plurality of element structures;
• bonding the element structures to a second substrate, the second substrate being conductive or having a conductive layer and the second substrate being carried on a carrier plate;
• removing the at least one first substrate from the element structures;
• depositing second side electrodes on a second surface of each of the plurality of element structures;
• bonding a second side of the element structures to a third substrate, the third substrate being conductive or having conductive layer;
• and
• removing the carrier plate.

A method of producing a detection/test tape comprising:

• depositing a material onto a surface of at least one first substrate to form a plurality of element structures;
• depositing electrodes on a surface of each of the plurality of element structures;
• bonding the element structures to a second substrate, the second substrate being conductive or having a conductive layer and the second substrate being carried on a carrier plate;
• removing the at least one first substrate from the element structures, further including, removing the at least one first substrate via a liftoff procedure using a radiation source;
• depositing second side electrodes on a second surface of each of the plurality of element structures;
• bonding a second side of the element structures to a third substrate, the third substrate being conductive or having a conductive layer;
• and
• removing the carrier plate.

A method of producing a detection/test tape comprising:

• depositing a material onto a surface of at least one first substrate to form a plurality of element structures;
• depositing electrodes on a surface of each of the plurality of element structures;
• bonding the element structures to a second substrate, the second substrate being conductive or having a conductive layer and the second substrate being carried on a carrier plate;
• removing the at least one first substrate from the element structures;
• depositing second side electrodes on a second surface of each of the plurality of element structures;
• bonding a second side of the element structures to a third substrate, the third substrate being conductive or having a conductive layer;
• bonding a second plurality of element structures to another surface of the third substrate, the other surface of the third substrate being conductive or having a conductive layer;
• removing the at least one first substrate from the second plurality of elements structures;
• depositing electrodes on a second surface of each of the second plurality of element structures;
• bonding a second side of the second plurality of element structures to a fourth substrate, the fourth substrate being conductive or having a conductive layer;
• and
• removing the carrier plate.