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AssigneeMatsushita Electric Industrial Co., Ltd.
InventorsKazuyoshi Honda, Noriyasu Echigo, Masaru Odagiri, Takanori Sugimoto
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Electrode layers (1, 2) are arranged on both sides of a dielectric layer (3) facing each other so as to configure a capacitor. Lead electrodes (4, 5) are formed in the electrode layers (1, 2). A penetrating electrode (6) that is insulated from the electrode layers (1, 2) is formed. An electronic component (10) configured in this manner is mounted on a wiring board, and a semiconductor chip can be mounted thereon. Along with connecting the semiconductor chip to the wiring board via the penetrating electrode (6), the semiconductor chip or the wiring board is connected to the lead electrodes (4, 5). In this manner, while suppressing the size increase of a mounted area, the capacitor or the like can be arranged near the semiconductor chip. Thus, the semiconductor chip is driven with high frequency more easily.
A method for manufacturing an electronic component comprising a plurality of first metal thin films, a plurality of second metal thin films and a plurality of dielectric thin films, wherein said first metal thin film and said second metal thin film are layered alternately with said dielectric thin film interposed therebetween, the method comprising:
Dependencies are inferred from the claim text.