Methods of forming conductive lines

A method of forming a conductive line, comprising:

• forming an elongated trench into first insulative material over a semiconductive substrate, the trench having opposing sidewall surfaces and a base surface;
• forming at least first and second different conductive materials within the trench, the first conductive material lining the trench, the second conductive material being received over the first conductive material;
• etching second conductive material from the trench effective to recess the second conductive material relative to an elevationally outer surface of the first insulative material proximate the trench;
• after said etching of the second conductive material, etching first conductive material from the trench effective to create slots extending along the opposing sidewall surfaces of the trench, the slots extending to the base surface of the trench, the etching being effective to form a conductive line within the trench comprising second conductive material received over first conductive material;
• and
• after said etching of the second conductive material, depositing a second insulative material different from the first insulative material within the trench over a top surface of the conductive line and within the trench slots.