Back to results
US 7,118,941 B2Granted
Method of fabricating a composite carbon nanotube thermal interface device
AssigneeIntel Corporation
InventorsYuegang Zhang, Valery M. Dubin, C. Michael Garner
Life of this patent
Estimating the term…
Abstract
A composite carbon nanotube structure including a number of carbon nanotubes disposed in a metal matrix. The composite carbon nanotube structure may be used as a thermal interface device in a packaged integrated circuit device.
Claims35
A method comprising:
- forming a number of carbon nanotubes on a surface of a substrate;
- depositing a layer of a metal material over the carbon nanotubes and exposed portions of the substrate surface to form a metal matrix around the carbon nanotubes;
- and
- separating the metal matrix and carbon nanotubes from the substrate to form a free-standing thermal interface device.
1 more element
A method comprising:
- forming a number of carbon nanotubes on a surface of a substrate;
- depositing a layer of a material over the carbon nanotubes and exposed portions of the substrate surface to form a matrix around the carbon nanotubes;
- separating the matrix and carbon nanotubes from the substrate to form a free-standing thermal interface device;
- attaching one side of the free-standing thermal interface device to a first component, the free-standing thermal interface device having a periphery substantially corresponding to a periphery of the first component;
- and
- attaching an opposing side of the free-standing thermal interface device to a second component.
3 more elements
Dependencies are inferred from the claim text.