Method of fabricating an electronic package having underfill standoff
AssigneeDelphi Technologies, Inc.
InventorsBruce A. Myers, David W. Ihms, Todd P. Oman
Life of this patent
Estimating the term…
Abstract
An electronic package having a controlled standoff height between a surface mount device and a circuit board. The electronic package includes a circuit board having a substrate and circuitry including mounting pads and a surface mount device having circuitry and contact terminals. Solder joints connect the contact terminals of the surface mount device to the mounting pads on the circuit board. A dielectric underfill is disposed between the circuit board and the surface mount device, and a plurality of standoff members are disposed in the underfill material to provide a separation distance between the circuit board and the surface mount device.
Claims17
A method of forming an electronic package having a controlled height standoff distance between a surface mount device and a circuit board, said method comprising the steps of:
- providing a circuit board having a substrate and circuitry comprising at least one mounting pad;
- providing a surface mount device having circuitry comprising at least one contact terminal;
- disposing an underfill material at a plurality of discrete locations between the circuit board and the surface mount device;
- disposing a plurality of standoff members in the underfill material at the plurality of discrete locations;
- and
- forming a solder joint to connect the at least one contact terminal of the surface mount device to the at least one of the mounting pad on the circuit board, wherein the standoff members provide a separation distance between the circuit board and the surface mount device;
- wherein the step of forming the solder joint comprises providing at least one solder ball in contact with the at least one contact pad and the at least one contact terminal, and heating the at least solder ball to reflow and form the solder joint;
- wherein the solder ball has a height dimension and wherein each of the standoff members has a height dimension less than the height dimension of the solder ball.
A method of forming an electronic package having a controlled height standoff distance between a surface mount device and a circuit board, said method comprising the steps of:
- providing a circuit board having a substrate and circuitry comprising at least one mounting pad;
- providing a surface mount device having circuitry comprising at least one contact terminal;
- disposing an underfill material at a plurality of discrete locations between the circuit board and the surface mount device, wherein the underfill material comprises an adhesive;
- disposing a plurality of substantially spherical standoff members in the underfill material at the plurality of discrete locations;
- providing at least one solder ball in contact with the at least one contact pad and the at least one contact terminal, wherein the solder ball has a height dimension and wherein each of the standoff members has a height dimension in the range of fifty to ninety percent of the height dimension of the solder ball;
- and
- forming a solder joint to connect the at least one contact terminal of the surface mount device to the at least one of the mounting device on the circuit board by heating the at least one solder ball to reflow and form the solder joint, wherein the standoff members provide a separation distance between the circuit board and the surface mount device.
A method of forming an electronic package having a controlled height standoff distance between a surface mount device and a circuit board, said method comprising the steps of:
- providing a circuit board having a substrate and circuitry comprising at least one mounting pad;
- providing a surface mount device having circuitry comprising at least one contact terminal;
- disposing an underfill material at a plurality of discrete locations between the circuit board and the surface mount device, wherein the underfill material comprises a solder flux;
- disposing a plurality of substantially spherical standoff members in the underfill material at the plurality of discrete locations;
- providing at least one solder ball disposed in the underfill material and in contact with the at least one contact pad and the at least one contact terminal, wherein the solder ball has a height dimension and wherein each of the standoff members has a height dimension in the range of fifty to ninety percent of the height dimension of the solder ball;
- and
- forming a solder joint to connect the at least one contact terminal of the surface mount device to the at least one of the mounting device on the circuit board by heating the at least one solder ball to reflow and form the solder joint, wherein the standoff members provide a separation distance between the circuit board and the surface mount device.
Dependencies are inferred from the claim text.