Manufacturing method and manufacturing apparatus for semiconductor device

A manufacturing apparatus for a semiconductor device, the apparatus comprising:

• a stage for disposing a substrate on which a plurality of leads are formed on an XY plane in a three-dimensional coordinate system consisting of XYZ axes;
• a carrier for disposing a semiconductor chip including a plurality of electrodes and the substrate so that a formation surface of the electrodes relatively faces a formation surface of the leads of the substrate with an interval;
• an adjuster for positioning the leads and the electrodes so that the leads and the electrodes respectively face each other;
• and
• a press for relatively pressing the electrodes against the leads,
• wherein the adjuster includes:
• first means for imaging the formation surface of the electrodes and the formation surface of the leads along an axis which intersects the XY plane at right angles;
• second means for obtaining a projected image of the formation surface of the electrodes and the formation surface of the leads projected onto a plane which intersects the Z axis at right angles;
• third means for calculating a difference between an image of one of the electrodes and an image of one of the leads in the projected image;
• fourth means for calculating a deformation value of at least one of the substrate and the semiconductor chip due to expansion or shrinkage necessary for eliminating the difference;
• fifth means for calculating a change in temperature of at least one of the substrate and the semiconductor chip necessary for obtaining the deformation value;
• and
• sixth means for changing the temperature of at least one of the substrate and the semiconductor chip based on the change in temperature.