Method for packaging a multi-chip module of a semiconductor device
AssigneeDongbu Electronics Co., Ltd.
InventorKyung Hee Koh
Life of this patent
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Abstract
A method for packaging a multi-chip module includes the steps of: connecting connection terminals of a tape of an anisotropic conductive adhesive film, on which a circuit is patterned to bond pads of the chip by applying an adhesive on the tape, applying an adhesive on an upper surface of the chip, folding the tape and attaching the folded tape to the upper surface of the chip and forming a plurality of ball terminals on a lower surface of the tape, the ball terminals being electrically connected to the connection terminals of the tape. An individual chip scale package may be manufactured by repeating the above steps.
Claims10
A method for packaging a multi-chip module, comprising the steps of:
- (a) connecting connection terminals of a tape of an anisotropic conductive adhesive film, on which a circuit is patterned to bond pads of a chip by applying a first anisotropic conductive adhesive on the tape and using a first C4 process;
- (b) applying an adhesive on an upper surface of the chip, folding the tape and attaching the folded tape to the upper surface of the chip;
- (c) forming a plurality of ball terminals on a lower surface of the tape, the ball terminals being electrically connected to the connection terminals of the tape;
- (d) manufacturing a plurality of individual chip scale packages by repeating the steps (a) to (c);
- and
- (e) laminating the individual chip scale packages, wherein the ball terminals of an upper individual chip scale package are electrically connected to the circuit on an outer surface of the tape which covers a lower individual chip scale package.
Dependencies are inferred from the claim text.