Back to results
US 7,118,935 B2Granted
Bump style MEMS switch
AssigneeIntel Corporation
InventorHanan Bar
Life of this patent
Estimating the term…
Abstract
A microelectromechanical system switch may be formed with a protrusion defined on the substrate which makes contact with a deflectable member arranged over the substrate. The deflectable member may, for example, be a cantilevered arm or a deflectable beam. The protrusion may be formed in the substrate in one embodiment using field oxide techniques.
Claims14
A method comprising:
- forming a microelectromechanical system switch including a cantilevered, deflectable member positioned over a semiconductor substrate, said member having a free end and a fixed end;
- forming in said substrate an electrical bump to be electrically contacted by the free end of said member;
- and
- forming a portion of said bump of an insulator.
1 more element
A method comprising:
- forming a silicon nitride layer over a semiconductor substrate;
- forming an opening in said silicon nitride layer;
- oxidizing to form a raised oxide aligned with said opening;
- forming a deflectable member over said raised oxide to be deflected towards and away from said raised oxide;
- and
- forming a metal layer over said raised oxide to form an electrical contact contactable by said deflectable member.
3 more elements
Dependencies are inferred from the claim text.