Method for manufacturing a light emitting device
OwnerDong-Sing Wuu, Ray-Hua Hornginventors
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Abstract
A method for manufacturing a light emitting device includes (a) preparing a semiconductor element formed with a crystalline substrate, and a temporary element, the temporary element including a laser-transmissive substrate and a laser-dissociable layer formed on the laser-transmissive substrate, (b) attaching the laser-dissociable layer of the temporary element to the epitaxial layer of the semiconductor element through a adhesive layer, (c) thinning the crystalline substrate, (d) applying a laser beam to the temporary element so as to dissociate the laser-dissociable layer of the temporary element, and removing the temporary element from the adhesive layer, and (e) removing the adhesive layer from the epitaxial layer of the semiconductor element.
Claims18
A method for manufacturing a light emitting device, comprising:
- (a) preparing a semiconductor element and a temporary element, the semiconductor element including a crystalline substrate having a top surface and a bottom surface, and an epitaxial layer formed on the top surface of the crystalline substrate, the temporary element including a laser-transmissive substrate and a laser-dissociable layer formed on the laser-transmissive substrate;
- (b) attaching the laser-dissociable layer of the temporary element to the epitaxial layer of the semiconductor element through a first adhesive layer;
- (c) thinning the crystalline substrate from the bottom surface of the crystalline substrate;
- (d) applying a laser beam to the temporary element so as to dissociate the laser-dissociable layer of the temporary element, and removing the temporary element from the first adhesive layer;
- and
- (e) removing the first adhesive layer from the epitaxial layer of the semiconductor element.
Dependencies are inferred from the claim text.