Coin cell protection against reverse insertion in cell holder
Assignee3SI Security Systems, Inc.
InventorsJoel Bartholf, Michael Larry Poorbaugh
Life of this patent
Estimating the term…
Abstract
A method and associated apparatus for preventing applying a reverse polarity voltage to an electronic circuit from a coin cell used to power such circuit by providing a first insulating wafer over the top conductive surface of a coin cell and a second insulating wafer over the bottom conductive surface of the cell. The first wafer has a central opening and the second wafer is designed to cover the portion of the bottom conductive surface corresponding to the opening of the first wafer so that when the two wafers of the protection system are placed over the coin cell with the first wafer and the insulating area positioned on the top and bottom conductive surfaces respectively, the insulating area extends fully under the first opening.
Claims15
A protection system for a coin cell comprising spaced, substantially parallel and substantially co-extensive top and bottom conductive surfaces said system comprising:
- a first insulating wafer adapted to fit over said top conductive surface of said coin cell said first wafer comprising a first opening;
- a second insulating wafer adapted to fit over a portion of said bottom conducting surface of said coin cell, said second wafer comprising an insulating area extending fully under the first opening and a second opening located so that when the two wafers are placed over the coin cell conductive surfaces, the first opening does not overlap the second opening;
- and
- wherein said coin cell is designed to fit in a cell holder having upper and lower contact electrodes designed to contact said top and bottom conductive surfaces respectively in non overlapping areas and wherein said openings in said top and bottom wafers are positioned so that when said insulating wafers are placed over a coin cell adapted to fit said coin cell holder, said upper and lower electrodes contact said top and bottom conducting surfaces respectively through said wafer openings when said battery is inserted in a first orientation in said holder and contact the insulating wafer when said coin cell is inserted in said holder in a second, inverted orientation.
A method for preventing applying a reverse polarity voltage to an electronic circuit from a coin cell used to power said circuit the ,method comprising:
- providing a first insulating wafer over a top conductive surface of said coin cell
- said first wafer comprising a first opening;
- providing a second insulating wafer over a portion of a bottom conducting surface of said coin cell, said second wafer comprising an insulating area extending fully under the first opening and a second opening located so that when the two wafers are placed over the coin cell conductive surfaces, the first opening does not overlap the second opening;
- and
- wherein said coin cell is designed to fit in a cell holder having upper and lower contact electrodes designed to contact said top and bottom conductive surfaces respectively in non overlapping areas and wherein said openings in said top and bottom insulating are positioned so that when said insulating are placed over a coin cell adapted to fit said coin cell holder said upper and lower electrodes contact said top and bottom conducting surfaces respectively through said wafer openings when said battery is inserted in a first orientation in said holder, and contact the insulating wafer when said coin cell is inserted in said holder in a second, inverted orientation.
A coin cell comprising a top conductive surface representing an electrical contact of a first polarity and a substantially parallel bottom conductive surface representing an electrical contact of a second polarity, said top conducting surface being substantially parallel to said top conductive surface, and
- a first insulating wafer on said top conductive surface covering substantially all of said top conductive surface said first insulating wafer comprising a first opening exposing a portion of said top conductive surface and
- a second insulating wafer on said bottom conducting surface completely covering at least an area on said bottom conducting surface opposite said first opening on said top conductive surface whereby exposed areas in said top and said bottom conductive surfaces do not overlap.
Dependencies are inferred from the claim text.