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AssigneeArakawa Chemical Industries, Ltd.
InventorsHideki Goda, Takayuki Fujiwara, Takeshi Takeuchi
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The present invention provides the following three laminates: First, a polyimide-metal laminate which is obtainable by applying to one side of a metal foil a silane-modified polyimide resin composition (A) comprising alkoxy-containing silane-modified polyimide (a) and a polar solvent (b), drying and curing the composition; Second, a polyamideimide-metal laminate which is obtainable by applying to one side of a metal foil a silane-modified polyamideimide resin composition (C-1) comprising methoxy-containing silane-modified polyamideimide (d), a polar solvent (b) and an inorganic filler (c), drying and curing the composition; and third, a polyimide-metal laminate in which the cured film of the above composition (A) has a metal plated layer thereon.
A polyimide-metal laminate that is obtainable by:
A polyimide-metal laminate which is obtainable by applying to a carrier film a silane-modified polyimide resin composition (A) comprising alkoxy-containing silane-modified polyimide (a) prepared by reacting polyamic acid (1) and/or polyimide (2) with epoxy-containing alkoxysilane partial condensate (3) obtained by dealcoholization reaction between an epoxy compound having one hydroxyl group per molecule and an alkoxysilane partial condensate having an average number of silicon atoms per molecule of 2–11, and a polar solvent (b), drying the applied composition, peeling off and curing the dried composition, and metal plating one side or both sides of the obtained cured polyimide film.
A polyamideimide-metal laminate that is obtainable by:
Dependencies are inferred from the claim text.