Surface treatment process for enhancing a release rate of metal ions from a sacrificial electrode and a related sacrificial electrode
AssigneeIndustrial Technology Research Institute
InventorsKon-Tsu Kin, Hong-Shiang Tang, Shu-Fei Chan, Wen-Tsang Chen
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Abstract
The present invention discloses a surface treatment process for enhancing both the release rate of metal ions from a sacrificial electrode, and the working life of the electrode. A high density of micro pores are formed on the surface of the sacrificial electrode. Chlorine ions are then implanted into the pores. The chlorine ions prevent a passive film from forming on the sacrificial electrode during use, in which an electric current flows through the sacrificial electrode.
Claims19
A surface treatment process for enhancing a release rate of metal ions from a sacrificial electrode, the process comprising:
- a) performing a surface pore formation process to form a high density distribution of micro pores on a surface of a metal electrode, wherein the metal electrode is an iron, aluminum or copper electrode;
- and
- b) implanting chlorine, bromine or iodine ions in the micro pores of the metal electrode.
An iron sacrificial electrode comprising:
- an electrode surface;
- a plurality of pores disposed on the electrode surface;
- and
- chlorine ions implanted in the plurality of pores;
- wherein the pores have openings that are less than 20 microns in size, and the pores have a density distribution of at least 104 pores per square centimeter.
Dependencies are inferred from the claim text.