Plating method and apparatus
AssigneeEbara Corporation
InventorsJunichiro Yoshioka, Nobutoshi Saito, Tsuyoshi Tokuoka
Life of this patent
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Abstract
The present invention provides a plating method and apparatus, which is capable of introducing plating solution into the fine channels and holes formed in a substrate without needing to add a surface active agent to the plating solution, and capable of forming a high-quality plating film having no defects or omissions. The plating method for performing electrolytic or electroless plating of an object using a plating solution comprises: conducting a plating operation after or while deaerating dissolved gas in the plating solution; and/or conducting a preprocessing operation using a preprocessing solution after or while deaerating dissolved gas in the preprocessing solution and subsequently conducting the plating operation.
Claims16
A method for plating a metal in fine channels formed in a surface of a substrate or in opening portions in a resist formed on a surface of a substrate, comprising:
- providing a substrate having fine channels formed in a surface of said substrate or having opening portions in a resist formed on the surface of said substrate;
- using a deaerating device to deaerate dissolved gas in a preprocessing solution so as to provide a deaerated preprocessing solution;
- supplying said deaerated preprocessing solution from said deaerating device to a preprocessing bath;
- contacting said surface of said substrate, or said resist formed on said surface of said substrate, with said deaerated preprocessing solution in said preprocessing bath so as to absorb air bubbles in said fine channels or in said opening portions into said deaerated preprocessing solution;
- and then
- contacting said surface of said substrate, or said resist formed on said surface of said substrate, with a plating solution for plating metal into said fine channels or into said opening portions.
Dependencies are inferred from the claim text.