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US 7,118,457 B2Granted
Method of forming a polishing pad for endpoint detection
AssigneeApplied Materials, Inc.
InventorsBoguslaw A. Swedek, Manoocher Birang
Life of this patent
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Abstract
A method of forming a polishing pad with a polishing layer having a polishing surface and a back surface. A plurality of grooves are formed on the polishing surface, and an indentation is formed in the back surface of the polishing layer. A region on the polishing surface corresponding to the indentation in the back surface is free of grooves or has shallower grooves.
Claims21
A method of manufacturing a polishing pad, comprising:
- forming a polishing layer as a single unitary body, the polishing layer having a polishing surface and a back surface, wherein forming the polishing layer includes:
- forming a first plurality of grooves on the polishing surface of the polishing layer;
- forming an indentation in the back surface of the polishing layer;
- and
- forming a region on the polishing surface corresponding at least to the indentation in the back surface, the region having a second plurality of grooves that are shallower than the first plurality of grooves.
2 more elements
A polishing pad, comprising:
- a polishing layer that is a single unitary body, the polishing layer having a polishing surface and a back surface;
- an indentation formed in the back surface of the polishing layer;
- a first plurality of grooves formed in the polishing surface in a region that does not correspond to the indentation in the back surface;
- and
- a second plurality of grooves formed in the polishing surface in a region corresponding at least to the indentation in the back surface, wherein the second plurality of grooves are shallower than the first plurality of grooves.
2 more elements
Dependencies are inferred from the claim text.