Semiconductor workpiece processing methods
AssigneeMicron Technology, Inc.
InventorsScott E. Moore, Scott G. Meikle, Magdel Crum
Life of this patent
Estimating the term…
Abstract
Semiconductor processors, sensors, semiconductor processing systems, semiconductor workpiece processing methods, and turbidity monitoring methods are provided. According to one aspect, a semiconductor processor includes a process chamber configured to receive a semiconductor workpiece for processing; a supply connection in fluid communication with the process chamber and configured to a supply slurry to the process chamber; and a sensor configured to monitor the turbidity of the slurry. Another aspect provides a semiconductor workpiece processing method including providing a semiconductor process chamber; supplying slurry to the semiconductor process chamber; and monitoring the turbidity of the slurry using a sensor.
Claims19
A semiconductor workpiece processing method comprising:
- providing a semiconductor process chamber;
- supplying slurry to the semiconductor process chamber;
- monitoring the turbidity of the slurry during the supplying using a sensor, wherein the monitoring comprises:
- emitting electromagnetic energy towards the slurry;
- and
- receiving at least some of the electromagnetic energy.
A semiconductor workpiece processing method comprising:
- providing a semiconductor processor having a process chamber configured to receive a semiconductor workpiece;
- supplying slurry to the process chamber using a connection;
- emitting electromagnetic energy towards the connection using a sensor;
- receiving at least some of the electromagnetic energy using the sensor;
- and
- generating a signal indicative of turbidity of the slurry responsive to the receiving.
A semiconductor workpiece processing method comprising:
- providing a semiconductor processor having a process chamber configured to receive a semiconductor workpiece;
- supplying slurry to the process chamber using a connection;
- emitting infrared electromagnetic energy using a source;
- splitting the infrared electromagnetic energy to direct some of the infrared electromagnetic energy towards the connection;
- first receiving at least some of the infrared electromagnetic energy passing through the connection using a first receiver;
- generating a feedback signal using the first receiver responsive to the first receiving;
- adjusting the emitting via the source responsive to the feedback signal to provide a substantially constant amount of electromagnetic energy to the first receiver;
- second receiving at least some of the infrared electromagnetic energy not passing through the connection using a second receiver;
- and
- generating a signal indicative of turbidity of the slurry using the second receiver responsive to the second receiving.
A semiconductor workpiece processing method comprising:
- providing a semiconductor process chamber;
- supplying slurry to the semiconductor process chamber;
- monitoring the turbidity of the slurry during the supplying using a sensor;
- and
- insulating the slurry from the sensor.
A semiconductor workpiece processing method comprising:
- providing a semiconductor process chamber;
- supplying slurry to the semiconductor process chamber using a supply connection;
- monitoring the turbidity of the slurry within the supply connection during the supplying, wherein the monitoring comprises monitoring using a sensor;
- and
- wherein the supply connection is configured to supply the slurry in at least a partially horizontal direction and the sensor is configured to monitor the slurry while being supplied in the at least partially horizontal direction.
A semiconductor workpiece processing method comprising:
- providing a semiconductor process chamber;
- supplying slurry to the semiconductor process chamber;
- and monitoring the turbidity of the slurry during the supplying using a sensor;
- and
- wherein the supplying comprises directly supplying the slurry to the semiconductor process chamber with no modification of a physical property of the slurry after the monitoring.
Dependencies are inferred from the claim text.