US 7,118,447 B2 · Semiconductor workpiece processing methods

Abstract

Semiconductor processor systems, systems configured to provide a semiconductor workpiece process fluid, semiconductor workpiece processing methods, methods of preparing semiconductor workpiece process fluid, and methods of delivering semiconductor workpiece process fluid to a semiconductor processor are provided. One aspect of the invention provides a semiconductor processor system including a process chamber adapted to process at least one semiconductor workpiece using a process fluid; a connection coupled with the process chamber and configured to receive the process fluid; a sensor coupled with the connection and configured to output a signal indicative of the process fluid; and a control system coupled with the sensor and configured to control at least one operation of the semiconductor processor system responsive to the signal.

Claims25

Dependent claims

A semiconductor workpiece processing method comprising:

providing a semiconductor processor adapted to process a semiconductor workpiece using a process fluid;
transporting the process fluid relative to the semiconductor processor using a connection;
flushing the connection using a flush fluid;
monitoring the flush fluid during the flushing;
and
wherein the monitoring comprises monitoring the flush fluid ir the connection.

3 more elements

Dependencies are inferred from the claim text.

Facts

Application

10/461,529Filed 12 Jun 2003 · division

Priority

3 Jun 1999

Published

US 2003/0022593 A123 Oct 2003

Granted

10 Oct 2006

Term ends

Not estimatedThe source records don’t support an estimate.

Classification4 codes

B24B 37/04
Lapping machines or devices; Accessories: designed for working plane surfaces
B24B 49/10
Measuring or gauging equipment for controlling the feed movement of the grinding tool or work; Arrangements of indicating or measuring…
B24B 57/02
Devices for feeding, applying, grading or recovering grinding, polishing or lapping agents: for feeding of fluid, sprayed, pulverised, or…
B24B
Machines, devices, or processes for grinding or polishing

Family

Application09/324,737Parent of this continuation-in-part · filed 3 Jun 1999

Application09/517,127Parent of this division · filed 2 Mar 2000

Application09/814,260Parent of this division · filed 21 Mar 2001

US 6,290,576 B1Parent of this continuation-in-part · filed 18 Sep 2001

US 2003/0199227 A1Pre-grant publication · published 23 Oct 2003

Application09/517,127Parent of this continuation-in-part

US 2003/0022593 A1Published application

US 7,118,445 B2Related patent

US 7,530,877 B1Related patent

US 7,118,447 B2This patent

From the US filing history. Foreign family members aren’t listed.

Semiconductor workpiece processing methods

Life of this patent

Semiconductor workpiece processing methods

Life of this patent

Abstract

Claims25