High accuracy inspection system and method for using same

A method for monitoring a process using a computer, comprising the steps of:

• locating a three dimensional product with respect to a process monitoring system;
• providing placement guidance signals at predetermined positions in relation to a region of the three dimensional product;
• placing an inspection data gathering component utilizing the placement guidance signals;
• capturing inspection data utilizing the inspection data gathering device;
• the inspection data gathering device being placed so the inspection data gathering device is capable of capturing predetermined inspection data;
• determining a range of acceptable two dimensional pattern characteristics for correctly performing the process on said three dimensional product;
• obtaining a single two dimensional pattern characteristic from the inspection data at a location in said region of the three dimensional product;
• and
• determining whether said single two dimensional pattern characteristic of said location on said three dimensional product is present within said range of acceptable two dimensional pattern characteristics;
• wherein said step of determining whether said single two dimensional pattern characteristic is present is performed by a computer.

A method for identifying defects in a product using a computer, comprising the steps of:

• locating a three dimensional product with respect to a process monitoring system;
• providing placement guidance signals at predetermined locations in relation to a region of the three dimensional product;
• placing an inspection data gathering component utilizing the placement guidance signals;
• capturing inspection data utilizing the inspection data gathering device;
• the inspection data gathering device being placed so the inspection data gathering device is capable of capturing predetermined inspection data;
• determining defect criteria for pattern characteristics of results of performing the process on said three dimensional product;
• obtaining a defect map from the inspection data at a location in said region of the three dimensional product;
• and
• obtaining a location of points in the defect map with respect to the location of the product and the placement guidance signals
• wherein said pattern characteristic are obtained by means of a computer.

A system for monitoring a process, the system comprising:

• means for determining a reference location of a product in three dimensional space with respect to a process monitoring system;
• means for providing placement guidance signals at predetermined positions in relation to a region of the product;
• means for placing an inspection data gathering device utilizing the placement guidance signals;
• means for capturing inspection data utilizing the inspection data gathering device;
• wherein the inspection data gathering device is placed so the inspection data gathering device is capable of capturing predetermined inspection data;
• means for generating a rotation and translation transform which enables said process monitoring system to define the location of said product placed in a field of view of the inspection data gathering device;
• means for applying said transform to CAD data defining the process being performed with respect to said product to provide transformed CAD data represented as a single two dimensional pattern characteristic of said process with respect to said field of view of the inspection data gathering device;
• and
• means for determining whether said single two dimensional pattern characteristic of the process obtained from the inspection data is present within a range of acceptable two dimensional pattern characteristics obtained from the process performed with respect to said product;
• wherein if the product is processed properly said two dimensional pattern characteristic of said process is present within said range of acceptable two dimensional pattern characteristics.