Heat-dissipation apparatus of portable computer
AssigneeChaun-Choung Technology Corp.
InventorChung Wu
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AssigneeChaun-Choung Technology Corp.
InventorChung Wu
Estimating the term…
A heat-dissipation apparatus of the portable computer is fabricated in a host and a display unit pivotal connected therein for dissipating the heat from the electronic component. The apparatus has a conductive part whose thickness is designed to be equal to the thickness of the portable computer when closed. The conductive part has a first connecting portion and a second connecting portion, which the second connecting portion is used to be inserted by a cooling end of a first heat pipe. The heating end of the first heat pipe extends into the host and faces to the electronic component. The first connecting portion is used to be inserted by a heating end of a second heat pipe. The cooling end of the second heat pipe extends to the display unit.
A heat-dissipation apparatus of portable computer fabricated in a host and a display unit pivotal connected together for cooling down an electronic component in the host, comprising:
A heat-dissipation apparatus of portable computer fabricated in a host and a display unit pivotal connected together for cooling down an electronic component in the host, comprising:
Dependencies are inferred from the claim text.
From the US filing history. Foreign family members aren’t listed.
Cooling means: for portable computers, e.g. for laptops
Indexing scheme relating to G06F1/20: heat conductive hinge
Computing and data processing
Term ended 4 Mar 2025 (estimated)
The present invention relates in general to a heat-dissipation apparatus of a portable computer, and more particular, to an apparatus which has a conductive part with the different axes for fabricating a first heat pipe extending onto the electronic component, and a second heat pipe extending to a display unit. The conductive part is not a hinge, so it has nothing to do with the supporting force of the portable computer. The thickness of the conductive part can be adjusted to fit the thickness of the portable computer for keeping the heat pipe being relative to the electronic component smoothly.
Nowadays, the portable computer needs to be reduced its weight and size for carrying out. The space of host of the portable computer therefore is reduced comparatively, specially the space for fabricating heat-dissipation apparatus. Due to the processing speed of the computer is much faster than before, the heat-dissipation issue is become much more important, too. How to compromise between larger space and better heat conductibility will be an important issue for manufacturer.
Conventional heat pipe has an excellent heat conductibility so as to be used in the heat-dissipation module usually. One example is referring to an U.S. Pat. No. 6,122,166 disclosed a personal computer cooling device having hinged heat pipe. The cooling device is composed by a first heat pipe and a second heat pipe, which forms a hinge at the same time by their combination for connecting the host and the display unit of the portable computer. One end of the first heat pipe is a hollow pipe which provides for the second heat pipe pivoted therein, and another end of the first heat pipe extends around the display unit. The end of the second heat pipe opposite to the end pivoted in the first heat pipe extends to a heat source of the host of the portable computer. Therefore, the first heat pipe will conduct the heat from the heat source to the second heat pipe, and second heat pipe dissipate the heat. That will save the space of the portable computer and leave another hinge structure out. But the above-mentioned hinge combined by the heat pipes can not provide a proper supporting force to handle the opening motion of the portable computer, and the combination of the heat pipes is not easier to fit different types of variable portable computers. If the heat pipes are unsuited to the specific portable computer by means of the wrong enforcement, the incorrect bending angle, or a difference between the heat pipes and the portable computer, they will raise during the portable computer opened. The efficiency of conduction will drop therefor.
These as well as other features of the present invention will become more apparent upon reference to the drawings therein:
FIG. 1 is a structural exploding schematic view of the heat-dissipation device as disclosed in the embodiment of this invention.
FIG. 2 is a structural combining schematic view of the heat-dissipation device as disclosed in the embodiment of this invention.
Reference will now be made in detail to the preferred embodiments of the present invention, examples of which are illustrated in the accompanying drawings. Wherever possible, the same reference numbers are used in the drawings and the description to refer to the same or like parts.
Please refer to FIGS. 1, 2, and 3. The heat-dissipation apparatus of portable computer of this invention comprises a portable computer 1, a conductive part 2 adjacent to a hinge of the portable computer 1, a first heat pipe 3, and a second heat pipe 4 at a different position from the first heat pipe 3.
The portable computer 1 comprises a host 11 and a display unit 12, which are pivotally combined together by a hinge 13. Therefore, the host 11 and the display unit 12 can be operated, such as be opened or be closed relatively, according to the hinge 13.