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US 7,116,456 B2Granted
Light modulator module package
AssigneeSamsung Electro-Mechanics Co., Ltd.
InventorsYoung Nam Hwang, Yeong Gyu Lee, Ohk Kun Lim
Life of this patent
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Abstract
Disclosed herein is a light modulator module package, which is advantageous because a size of the module package is minimized and heat is efficiently dispersed while the optical properties of a light modulator device are maintained.
Claims4
A light modulator module package, comprising:
- a printed circuit board having an inner circuit and a hole to receive an incident beam of light;
- a light transmissive lid attached to an upper surface of the printed circuit board;
- a light modulator device formed on the light transmissive lid to correspond to a position of the hole in the printed circuit board so as to modulate the incident beam of light passing through the hole in the printed circuit board to be emitted as diffracted light;
- one or more drive integrated circuits formed around the light modulator device to supply a driving voltage to the light modulator device, in response to an externally input control signal;
- a connector formed on one side of the printed circuit board to supply the externally input control signal to the drive integrated circuits;
- and
- a molded part to enclose the printed circuit board and the light transmissive lid so as to hold the printed circuit board and the light transmissive lid.
4 more elements
Dependencies are inferred from the claim text.