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US 7,116,215 B2Granted
Sensor device and ceramic package for mounting electronic components
AssigneeDenso Corporation
InventorJun Oonishi
Life of this patent
Estimating the term…
Abstract
A sensor device includes a G sensor producing an electric signal in accordance with physical displacement of its sensing portion and a casing mounting this G sensor. A casing chamber is sealed with a potting material so that the G sensor is covered with the potting material. The potting material has the role of surely damping the high-frequency vibration which generally causes resonance. Thus, the G sensor can accurately detect the collision and vibration without being adversely influenced by the resonance.
Claims27
A sensor device comprising:
- an electronic collision sensor for outputting an electric signal in accordance with a physical displacement of a sensing portion of the sensor, the displacement being caused by collision with an object;
- a casing in which said electronic collision sensor is mounted;
- and
- a vibration damping member provided between at least part of said electronic collision sensor and said casing for damping a high-frequency vibration in a frequency band equal to or higher than 1 kHz such that the high-frequency vibration transmitted to the electronic collision sensor through said casing is suppressed.
1 more element
A ceramic package for an electronic component, comprising:
- a main body on which an electronic component is mounted;
- a metallic electrode attached to said main body prior to the mounting of said electronic component on said main body, said electronic component being mounted on said main body so as to be electrically connected with said metallic electrode;
- and
- a lead bonded to said metallic electrode by welding after the mounting of said electronic component on said main body such that said metallic electrode prevents an influence of the welding from being exerted on said electronic component.
1 more element
A sensor device comprising;
- an electronic sensor for outputting an electric signal in accordance with physical displacement of a sensing portion;
- and
- a casing in which said electronic sensor is mounted,
- wherein casing comprises:
- a primary molded portion formed by primary molding so as to surround said electronic sensor with a first resin material capable of damping high-frequency vibration, and
- a secondary molded portion formed by secondary molding so as to surround said primary molded portion with a second resin material harder than said first resin material.
3 more elements
A sensor device, comprising:
- an electronic collision sensor for outputting an electric signal in accordance with a physical displacement of a sensing portion caused by collision with an object;
- and
- a casing in which said electronic collision sensor is mounted,
- wherein said casing is made of a resin material containing a vibration damping material capable of damping a high-frequency vibration in a frequency band equal to or higher than 1 kHz to suppress the high-frequency vibration transmitted to the electronic collision sensor through said casing.
1 more element
A sensor device comprising:
- an electronic sensor for outputting an electric signal in accordance with physical displacement of a sensing portion;
- a casing in which said electronic sensor is mounted and
- a dynamic damper attached to said electronic sensor, and said dynamic damper being tuned to a resonance point of said sensing portion.
A sensor device comprising:
- an electronic sensor for outputting an electric signal in accordance with physical displacement of a sensing portion;
- a casing in which said electronic sensor is mounted;
- and
- a vibration damping member provided between at least part of said electronic sensor and said casing for damping a high-frequency vibration,
- wherein physical properties of said vibration damping member including a hardness, a dielectric dissipation factor, a shape and a size are configured so as to enhance the properties of said vibration damping member for damping the high-frequency vibration including vibration at a resonance point of said electronic sensor.
2 more elements
A sensor device, comprising:
- an electronic sensor for outputting an electric signal in accordance with physical displacement of a sensing portion;
- and
- a casing in which said electronic sensor is mounted,
- wherein said casing is made of a resin material containing a vibration damping material capable of damping a high-frequency vibration in a frequency band equal to or higher than 1 kHz, and said electronic sensor is integrally molded with said resin material containing the vibration damping material.
1 more element
Dependencies are inferred from the claim text.