Temperature-compensated output buffer method and circuit
AssigneeMicron Technology, Inc.
InventorsDong Pan, Leel S. Janzen
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AssigneeMicron Technology, Inc.
InventorsDong Pan, Leel S. Janzen
Estimating the term…
A temperature-compensated output buffer circuit is disclosed, which includes a pull-up circuit including a first pull-up transistor for providing a first pull-up output signal responsive to a pull-up input signal, and a supplemental pull-up circuit in parallel with the first pull-up transistor. The supplemental pull-up circuit is configured to generate a supplemental pull-up output signal with the first pull-up output signal and the supplemental pull-up output signal forming a pull-up output signal. The output buffer further includes a pull-down circuit, including a first pull-down transistor for providing a first pull-down output signal and a supplemental pull-down circuit in parallel with the first pull-down transistor. The supplemental pull-down circuit is configured to generate a supplemental pull-down output signal with the pull-up output signal and the pull-down output signal coupled to form an output buffer output signal. Methods of operation, memory devices, semiconductor substrates and electronic systems embodying the invention are also disclosed.
An output buffer, comprising:
An output buffer, comprising:
An output buffer, comprising:
An output buffer, comprising:
An output buffer, comprising:
A memory device, comprising:
A memory device, comprising:
A memory device, comprising:
A memory device, comprising:
A memory device, comprising:
A semiconductor substrate on which is fabricated a semiconductor memory device, comprising:
A semiconductor substrate on which is fabricated a semiconductor memory device, comprising:
A semiconductor substrate on which is fabricated a semiconductor memory device, comprising:
A method of providing a data output signal, comprising:
An electronic system comprising an input device, an output device, a memory device, and a processor device coupled to the input, output, and memory devices, at least one of the input, output, memory, and processor devices including a semiconductor memory comprising:
Dependencies are inferred from the claim text.