Loading patent…
AssigneeMicron Technology, Inc.
InventorsWarren M. Farnworth, Malcolm Grief, Gurtej S. Sandhu
Estimating the term…
A method of engaging electrically conductive test pads on a semiconductor substrate having integrated circuitry for operability testing thereof includes: a) providing an engagement probe having an outer surface comprising a grouping of a plurality of electrically conductive projecting apexes positioned in proximity to one another to engage a single test pad on a semiconductor substrate; b) engaging the grouping of apexes with the single test pad on the semiconductor substrate; and c) sending an electric signal between the grouping of apexes and test pad to evaluate operability of integrated circuitry on the semiconductor substrate. Constructions and methods are disclosed for forming testing apparatus comprising an engagement probe having an outer surface comprising a grouping of a plurality of electrically conductive projecting apexes positioned in proximity to one another to engage a single test pad on a semiconductor substrate.
An engagement probe comprising semiconductor bulk substrate material, the probe having a grouping of a plurality of projecting apexes positioned in sufficient proximity to one another to collectively removably engage a plurality of different single conductive pads on a plurality of different semiconductor substrates to test circuitry coupled with the single conductive pads;
An engagement probe comprising semiconductor bulk substrate material, the probe having a grouping of a plurality of projecting apexes positioned in sufficient proximity to one another to collectively removably engage a plurality of different single conductive pads on a plurality of different semiconductor substrates to test circuitry coupled with the single conductive pads;
An engagement probe comprising semiconductor bulk substrate material, the probe having a grouping of a plurality of projecting apexes positioned in sufficient proximity to one another to collectively removably engage a plurality of different single conductive pads on a plurality of different semiconductor substrates to test circuitry coupled with the single conductive pads;
An engagement probe comprising semiconductor bulk substrate material, the probe having a grouping of a plurality of projecting apexes positioned in sufficient proximity to one another to collectively removably engage a plurality of different single conductive pads on a plurality of different semiconductor substrates to test circuitry coupled with the single conductive pads, wherein the plurality of the projecting apexes engage only a single one of the conductive pads at a given moment in time;
An engagement probe comprising semiconductor bulk substrate material, the probe having a grouping of a plurality of projecting apexes positioned in sufficient proximity to one another to collectively removably engage a plurality of different single conductive pads on a plurality of different semiconductor substrates to test circuitry coupled with the single conductive pads, wherein the plurality of the projecting apexes engage only a single one of the conductive pads at a given moment in time;
Dependencies are inferred from the claim text.