Overhang support for a stacked semiconductor device, and method of forming thereof
AssigneeTaiwan Semiconductor Manufacturing Company, Ltd.
InventorsTe-Tsung Chao, Mirng-Ji Lii, Chung-Yi Lin, Abel Chang
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Abstract
A stacked, multi-die semiconductor device and method of forming thereof. A preferred embodiment comprises disposing a stack of semiconductor dies to a substrate. The stacking arrangement is such that a lateral periphery of an upper die is cantilevered over a lower die thereby forming a recess. A supporting adhesive layer containing a filler is disposed upon the substrate about the lateral periphery of the lower die and substantially filling the recess. In one preferred embodiment, the filler comprises microspheres. In another preferred embodiment, the filler comprises a dummy die, an active die, or a passive die.
Claims6
A semiconductor device comprising:
- a substrate;
- a plurality of semiconductor dies, the dies being stacked over the substrate so that an upper die edge overhangs a lower die edge thereby forming a recess;
- a first adhesive bonding adjacent die surfaces, the first adhesive comprising a first filler of a substantially uniform size, wherein the first filler is arranged substantially in a first monolayer between adjacent die surfaces;
- and
- a second adhesive disposed within the recess, the second adhesive comprising a second filler, the second filler having a size that is different from the one of the first filler, wherein the second filler is arranged substantially in a second monolayer.
Dependencies are inferred from the claim text.