Multi-component integrated circuit contacts

An integrated circuit connection, comprising:

• an elongate first electrical conductor including a first portion and a second portion adapted to be fixed to an integrated circuit structure;
• a second electrical conductor enclosing at least part of the first portion;
• and
• wherein the first portion includes a neck having a first dimension and a head on the neck, and the head including a second dimension that is greater than the first dimension, wherein the second dimension is on the order of tens of microns and the first dimension is on the order of ones of microns.

An integrated circuit connection comprising,

• an elongate first electrical conductor including a first portion and a second portion adapted to be fixed to an integrated circuit structure;
• a second electrical conductor fixed to the first portion;
• wherein the first portion includes a neck having a first dimension and a head on the neck, and the head including a second dimension that is greater than the first dimension;
• and
• wherein the second portion includes a third dimension that is greater than at least one of the first dimension and the second dimension.

An integrated circuit connection comprising,

• an elongate first electrical conductor including a first portion and a second portion adapted to be fixed to an integrated circuit structure;
• a second electrical conductor fixed to the first portion;
• wherein the first portion includes a neck having a first dimension and a head on the neck, and the head including a second dimension that is greater than the first dimension;
• and
• wherein the second portion includes a third dimension that is greater than both the first dimension and the second dimension.

An integrated circuit connection assembly, comprising:

• an elongate first electrical conductor including a first portion and a second portion adapted to be fixed to an integrated circuit structure, wherein the first portion includes a radially outwardly extending head, wherein the second portion includes a second diameter greater than a diameter of the head;
• an elongate second electrical conductor separate from the first electrical conductor and including a third portion and a fourth portion adapted to be fixed to an integrated circuit structure;
• and
• a third electrical conductor fixed to the head of the first portion.

An integrated circuit connection assembly, comprising:

• a base in an integrated circuit structure;
• an elongate first electrical conductor including a first portion and a second portion connected to the base, wherein the first portion and the second portion each include a dimension less than a dimension of the base;
• an elongate second electrical conductor including a third portion and a fourth portion connected to the base, wherein the second electrical conductor is separate from the first electrical conductor;
• and
• a third electrical conductor fixed to the first portion, the third electrical conductor being adapted to join to another contact.

An integrated circuit connection assembly, comprising:

• a base in an integrated circuit structure;
• an elongate first electrical conductor including a first portion and a second portion connected to the base;
• an elongate second electrical conductor including a third portion and a fourth portion connected to the base, wherein the second electrical conductor is separate from the first electrical conductor;
• a third electrical conductor fixed to the first portion, the third electrical conductor being adapted to join to another contact;
• and
• wherein the base, the first electrical conductor, and the second electrical conductor are formed of a same material.

An integrated circuit connection assembly, comprising:

• a base in an integrated circuit structure;
• an elongate first electrical conductor including a first portion and a second portion connected to the base;
• an elongate second electrical conductor including a third portion and a fourth portion connected to the base, wherein the second electrical conductor is separate from the first electrical conductor;
• a third electrical conductor fixed to the first portion, the third electrical conductor being adapted to join to another contact;
• and
• wherein the base, the first electrical conductor, and the second electrical conductor all include nickel.

An integrated circuit connection assembly comprising:

• a base in an integrated circuit structure;
• an elongate first electrical conductor including a first portion and a second portion connected to the base;
• an elongate second electrical conductor including a third portion and a fourth portion connected to the base;
• and
• a third electrical conductor fixed to the first portion, the third electrical conductor being adapted to join to another contact, and wherein the third electrical conductor includes SnPb.

An integrated circuit connection assembly comprising:

• a base in an integrated circuit structure;
• an elongate first electrical conductor including a first portion and a second portion connected to the base;
• an elongate second electrical conductor including a third portion and a fourth portion connected to the base;
• and
• a third electrical conductor fixed to the first portion, the third electrical conductor being adapted to join to another contact, and wherein the first electrical conductor has a first height and the second electrical conductor has a second height, and wherein the first height is different than the second height.

An integrated circuit connection, comprising:

• a spike adapted to be fixed to an integrated circuit structure, wherein the spike includes nickel;
• a solder ball fixed to the spike;
• wherein the spike includes a neck having a first dimension and a head on the neck, and the head including a second dimension that is greater than the first dimension, the neck having a greater height than the head by at least one order of magnitude;
• and
• wherein the solder ball extends around the head and onto a portion of the neck.

An integrated circuit connection comprising:

• a spike adapted to be fixed to an integrated circuit structure, wherein the spike includes nickel;
• wherein the spike includes a neck having a first dimension and a head on the neck, the head including a second dimension that is greater than the first dimension, wherein the neck is elongate and includes a first portion within the integrated circuit structure and a second portion connected to the head;
• a solder ball fixed to the spike;
• and
• wherein the solder ball extends around the head and onto a portion of the neck.

An integrated circuit connection comprising:

• a spike adapted to be fixed to an integrated circuit structure;
• a solder ball fixed to the spike;
• and
• wherein the spike includes a neck having a first dimension and a head on the neck, and the head including a second dimension that is greater than the first dimension, wherein the neck is elongate and includes a first portion within the integrated circuit structure and a second portion connected to the head, and wherein the first portion includes a third dimension that is greater than at least one of the first dimension and the second dimension.

An integrated circuit connection comprising:

• a spike adapted to be fixed to an integrated circuit structure;
• a solder ball fixed to the spike;
• and
• wherein the spike includes a neck having a first dimension and a head on the neck, and the head including a second dimension that is greater than the first dimension, wherein the neck is elongate and includes a first portion within the integrated circuit structure and a second portion connected to the head, and wherein the first portion includes a third dimension that is greater than both the first dimension and the second dimension.

A memory device, comprising:

• a memory circuit structure;
• and
• at least one I/O connection connected to the memory circuit, the at least one I/O connection including:
• an elongate first electrical conductor including a first portion and a second portion adapted to be fixed to the memory circuit structure, wherein the first portion includes a neck having a first dimension and a head on the neck, and the head including a second dimension that is greater than the first dimension;
• and
• a second electrical conductor fixed to at least the head of the first portion, the second electrical connector being adapted to connect to an external circuit.

A memory device, comprising:

• a memory circuit structure;
• and
• at least one I/O connection connected to the memory circuit, the at least one I/O connection including:
• an elongate first electrical conductor including a first portion and a second portion adapted to be fixed to the memory circuit structure;
• a second electrical conductor fixed to the first portion, the second electrical connector being adapted to connect to an external circuit;
• wherein the memory circuit structure includes:
• an integrated circuit;
• a bond pad connected to the integrated circuit;
• and
• a redistribution level on the integrated circuit, wherein the redistribution level includes an elongate conductive trace, wherein the first electrical conductor contacts the trace, and wherein the trace includes aluminum.

An integrated circuit package, comprising:

• an integrated circuit;
• a redistribution level on the integrated circuit;
• at least one I/O connection electrically connected to the integrated circuit and fixed to the redistribution level, the at least one I/O connection including:
• a conductive spike including a first portion outside the redistribution level and a second portion fixed in the redistribution level, wherein the first portion includes a neck having a first dimension and a head on the neck, and the head including a second dimension that is greater than the first dimension;
• and
• a conductive solder bump fixed to the first portion.

An integrated circuit package, comprising:

• an integrated circuit;
• a redistribution level on the integrated circuit, wherein the integrated circuit includes a bond pad;
• at least one I/O connection electrically connected to the integrated circuit and fixed to the redistribution level, the at least one I/O connection including:
• a conductive spike including a first portion outside the redistribution level and a second portion fixed in the redistribution level;
• a conductive solder bump fixed to the first portion;
• wherein the redistribution level includes a trace connected to the bond pad and the second portion of the spike;
• and
• wherein the trace includes an elongate body having a first cap at a first end of the body and a second cap at a second end of the body, wherein the body includes aluminum.

An electrical assembly, comprising:

• a first electrical device having a first electrical contact;
• and
• a second electrical device having an integrated circuit structure and a second electrical contact connected to the first electrical contact, the second electrical contact including:
• a rigid conductor adapted to have a first portion fixed in the integrated circuit structure and a second portion extending from the integrated circuit structure, wherein the second portion includes a neck having a first dimension and a head on the neck, and the head including a second dimension that is greater than the first dimension, wherein the first portion includes a third dimension that is greater than at least one of the first dimension and the second dimension;
• and
• a collapsible conductor fixed to the rigid conductor both on the head and on a portion of the neck, the collapsible conductor forming a mechanical connection with the first electrical contact.

An electrical assembly, comprising:

• a first electrical device having a first electrical contact;
• and
• a second electrical device having an integrated circuit structure and a second electrical contact connected to the first electrical contact, the second electrical contact being separate from the first electrical contact and including:
• a rigid conductor adapted to have a first portion fixed in the integrated circuit structure and a second portion extending radially outwardly from the first portion, wherein the rigid conductor includes a metal, wherein the second portion has a first surface adjacent the first portion and a second surface remote from the first surface, wherein at least one of the first surface and the second surface are non-planar;
• and
• a collapsible conductor fixed to the rigid conductor both on the first surface and the second surface, the collapsible conductor forming a mechanical connection with the first electrical contact.

An electrical assembly, comprising:

• a first electrical device having a first electrical contact;
• and
• a second electrical device having an integrated circuit structure and a second electrical contact connected to the first electrical contact, the second electrical contact including:
• an elongate, rigid conductor adapted to have a first portion fixed in the integrated circuit structure and a second portion extending from the integrated circuit structure, wherein the rigid conductor includes nickel;
• and
• a collapsible conductor fixed to the rigid conductor on both the first portion and the second portion, the collapsible conductor forming a mechanical connection with the first electrical contact.

An electrical assembly, comprising:

• a first electrical device having a first electrical contact wherein the first electrical device includes a microprocessor;
• and
• a second electrical device having an integrated circuit structure and a second electrical contact connected to the first electrical contact, the second electrical contact including:
• a rigid conductor adapted to have a first portion fixed in the integrated circuit structure and a second portion extending from the integrated circuit structure, wherein the rigid conductor is elongate and includes nickel;
• and
• a collapsible conductor fixed to the rigid conductor, the collapsible conductor forming a mechanical connection with the first electrical contact.

An electrical assembly comprising:

• a first electrical device having a first electrical contact wherein the first electrical device includes a microprocessor;
• and
• a second electrical device having an integrated circuit structure and a second electrical contact connected to the first electrical contact, the second electrical contact including:
• a rigid conductor adapted to have a first portion fixed in the integrated circuit structure and a second portion extending from the integrated circuit structure;
• and
• a collapsible conductor fixed to the rigid conductor, the collapsible conductor forming a mechanical connection with the first electrical contact, and
• wherein the microprocessor has a maximum temperature threshold of about 200 degrees Celsius.

An electrical assembly comprising:

• a first electrical device having a first electrical contact, wherein the first electrical device includes an electromagnetic system;
• and
• a second electrical device having an integrated circuit structure and a second electrical contact connected to the first electrical contact, the second electrical contact including:
• a rigid conductor adapted to have a first portion fixed in the integrated circuit structure and a second portion extending from the integrated circuit structure;
• and
• a collapsible conductor fixed to the rigid conductor, the collapsible conductor forming a mechanical connection with the first electrical contact, and whereinthe electromagnetic system has a maximum temperature threshold of about 180 degrees Celsius.

An integrated circuit connection comprising:

• a spike adapted to be fixed to an integrated circuit structure;
• and
• a solder ball fixed to the spike, wherein the spike extends into the solder ball, and
• wherein the spike has a height above the integrated circuit structure of about 5 microns.

An integrated circuit connection comprising:

• a spike adapted to be fixed to an integrated circuit structure;
• and
• a solder ball fixed to the spike, wherein the spike extends into the solder ball, and,
• wherein the solder ball has a diameter of about 25 microns.

An integrated circuit connection, comprising:

• an integrated circuit structure including an upper surface;
• a first component including a first portion within the integrated circuit structure and a second portion extending above the upper surface, wherein the second portion includes a neck having a first dimension and a head on the neck, and the head including a second dimension that is greater than the first dimension, wherein the second dimension is on the order of tens of microns and the first dimension is on the order of ones of microns, and wherein the first portion includes a non planar surface remote from the second portion;
• and
• a second component on the second portion.

An integrated circuit connection, comprising:

• an integrated circuit structure including an upper surface;
• a first component including a first portion within the integrated circuit structure and a second portion extending above the upper surface, wherein the second portion includes a neck having a first dimension and a head on the neck, and the head including a second dimension that is greater than the first dimension;
• and
• a second component on the second portion, and wherein the second component contacts the upper surface.

An electrical assembly, comprising:

• a first electrical device having a first electrical contact wherein the first electrical device includes a microprocessor;
• and
• a second electrical device having an integrated circuit structure and a second electrical contact connected to the first electrical contact, the second electrical contact including:
• a rigid conductor adapted to have a first portion fixed in the integrated circuit structure and a second portion extending from the integrated circuit structure;
• and
• a collapsible conductor fixed to the rigid conductor, the collapsible conductor forming a mechanical connection with the first electrical contact, wherein the microprocessor has a maximum temperature threshold of about 200 degrees Celsius, and wherein the second portion includes a neck having a first dimension and a head on the neck, and wherein the head includes a second dimension that is greater than the first dimension.

An electrical assembly comprising:

• a first electrical device having a first electrical contact, wherein the first electrical device includes an electromagnetic system;
• and
• a second electrical device having an integrated circuit structure and a second electrical contact connected to the first electrical contact, the second electrical contact including:
• a rigid conductor adapted to have a first portion fixed in the integrated circuit structure and a second portion extending from the integrated circuit structure;
• and
• a collapsible conductor fixed to the rigid conductor, the collapsible conductor forming a mechanical connection with the first electrical contact, wherein the electromagnetic system has a maximum temperature threshold of about 180 degrees Celsius, and wherein the second portion includes a neck having a first dimension and a head on the neck, and wherein the head includes a second dimension that is greater than the first dimension.