US 7,115,990 B2 · Bumped die and wire bonded board-on-chip package

Abstract

An apparatus for making a semiconductor assembly and, specifically, interconnecting a semiconductor die to a carrier substrate. The carrier substrate includes a first surface and a second surface with at least one opening therethrough. The die includes an active surface and a back surface, wherein the die is attached facedown to the first surface of the carrier substrate with conductive bumps therebetween. In addition, a plurality of bond wires is attached through the at least one opening in the carrier substrate between the active surface of the die and the second surface of the carrier substrate. With this arrangement, both the conductive bumps and the bond wires share in the electrical interconnection between the die and the carrier substrate, thereby allowing more space for bond pads to interconnect with bond wires and/or allowing for smaller die sizes.

Claims54

Dependent claims

A semiconductor assembly comprising:

a substrate having a first surface having at least one bond pad thereon, a second surface having at least one bond pad thereon and at least one opening therethrough, the at least one opening in the substrate extending from the first surface to the second surface of the substrate, the substrate comprising a substrate of ceramic, silicone, glass, and combinations thereof;
a semiconductor die having an active surface having a plurality of bond pads located thereon and a back surface, the active surface of the semiconductor die attached to the first surface of the substrate;
a plurality of bond wires extending through the at least one opening in the substrate, portions of the plurality of bond wires attached to some of the plurality of bond pads on the active surface of the semiconductor die and attached to portions of the second surface of the substrate;
and
a plurality of conductive bumps disposed between other bond pads on the active surface of the semiconductor die and the first surface of the substrate and disposed on the at least one bond pad on the second surface of the substrate.

2 more elements

Dependencies are inferred from the claim text.

Bumped die and wire bonded board-on-chip package

Life of this patent

Bumped die and wire bonded board-on-chip package

Life of this patent

Abstract

Claims54