Adhesive sheet for producing a semiconductor device
AssigneeNitto Denko Corporation
InventorKazuhito Hosokawa
Life of this patent
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Abstract
An adhesive sheet for producing a semiconductor device, which includes a base layer and an adhesive layer and is used in the process for producing the semiconductor device including the step of sealing a semiconductor element connected to an electric conductor with a sealing resin on the adhesive layer, wherein the adhesive layer of the adhesive sheet includes a rubber component and an epoxy resin component and the ratio of the rubber component in organic materials in the adhesive layer is from 5 to 40% by weight. According to this adhesive sheet, pollution is not caused by silicon components, a sufficient elastic modulus can be kept even at high temperature, and a problem that paste remains is not easily caused.
Claims19
An adhesive sheet for producing a semiconductor device, which comprises a base layer and an adhesive layer and is used in the process for producing the semiconductor device comprising the step of sealing a semiconductor element connected to an electric conductor with a sealing resin on the adhesive layer,
- wherein the adhesive layer of the adhesive sheet comprises a rubber component and an epoxy resin component and the ratio of the rubber component in organic materials in the adhesive layer is from 5 to 40% by weight, and
- wherein the tensile storage elastic modulus of the adhesive layer is 1 MPa or more at 200° C. after the adhesive layer is cured.
An adhesive sheet for producing a semiconductor device, comprising:
- a base layer;
- and an adhesive layer formed on the base layer, comprising a rubber component and an epoxy resin component, said rubber component constituting 5–40% by weight of organic materials of the adhesive layer, said adhesive layer having a surface on which a semiconductor element connected to an electric conductor is sealed with a sealing resin.
- wherein the adhesive layer has a tensile storage elastic modulus of 1 MPa or more as measured at 200° C. after the adhesive layer is cured.
A semiconductor device comprising:
- a adhesive sheet comprising a base layer and an adhesive layer formed on the base layer, said adhesive layer comprising a rubber component and an epoxy resin component, said rubber component constituting 5–40% by weight of organic materials of the adhesive layer;
- and
- a semiconductor element connected to an electric conductor, which is sealed with a sealing resin on the adhesive layer of the adhesive sheets
- wherein the adhesive layer has a tensile storage elastic modulus of 1 MPa or more as measured at 200° C. after the adhesive layer is cured.
An adhesive sheet for producing a semiconductor device, comprising a base layer having a thickness of 10–200μm and an adhesive layer having a thickness of 1–50μm, wherein the adhesive layer comprises a rubber component and an epoxy resin component, and the rubber component constitutes 5–40% by weight of organic materials of the adhesive layer,
- wherein the tensile storage elastic modulus of the adhesive layer is 1 MPa or more at 200° C. after the adhesive layer is cured.
Dependencies are inferred from the claim text.