Multilayer, thin-film electronic devices
AssigneeThe Trustees of Princeton University
InventorSigurd Wagner
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Abstract
Multilayer thin-film electronics are manufactured at high speed, even while the various component functions are manufactured separately under conditions tailored to optimize component performance and yield. Each function or group of functions is fabricated on a separate flexible substrate. These flexible substrates are bonded to each other using adhesive films that are anisotropic electrical conductors or optical light guides. The bonding is performed by laminating the flexible substrates to each other in a continuous process, using the anisotropic conductor as the bonding layer.
Claims30
A thin-film electronic device comprising:
- a first substrate having active electronics formed thereon;
- a second substrate having active electronics formed thereon, the active electronics of the first substrate positioned in facing relation with the active electronics of the second substrate;
- and
- an anisotropic electrical conductor positioned between the first and second substrates and encapsulating the active electronics.
A thin-film electronic device comprising:
- a first substrate having active electronics formed thereon;
- a second substrate having active electronics formed thereon, the active electronics of the first substrate positioned in facing relation with the active electronics of the second substrate;
- and
- a light guide positioned between the first and second substrates and encapsulating the active electronics.
Dependencies are inferred from the claim text.