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US 7,115,978 B2Granted
Package Structure
AssigneeOrient Semiconductor Electronics Limited
InventorsKuo-Yang Sun, Chia-Ming Yang
Life of this patent
Estimating the term…
Abstract
A package structure includes a lead frame having a plurality of leads, each of which includes a first recession, at least a first device, and a plurality of solder joints respectively positioned in the first recessions for connecting the first device to the lead frame.
Claims6
A package structure comprising:
- a lead frame having a plurality of leads, which includes a first recession and a second recession;
- at least a semiconductor chip;
- a plurality of first solder joints respectively positioned in the first recessions for connecting the semiconductor chip to the lead frame;
- at least one passive device having a plurality of outputs respectively positioned in the second recessions;
- and
- a plurality of second solder joints respectively positioned in the second recessions for connecting the passive device to the lead frame.
3 more elements
Dependencies are inferred from the claim text.