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US 7,115,975 B2Granted
Semiconductor device, process of producing semiconductor device, and ink jet recording head
AssigneeCanon Kabushiki Kaisha
InventorToshihiro Mori
Life of this patent
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Abstract
When bonding inner leads of a flexible film wiring board to electrode pads of a semiconductor element substrate, by absorbing a stress generated due to a difference in thermal expansion coefficient between the flexible film wiring board and the semiconductor element substrate during cooling after heat-bonding, by a through-hole or recessed groove portion formed in the inner leads, it is possible to prevent peeling off of a bonding portion and improve the reliability.
Claims7
A semiconductor device comprising:
- a support member;
- a flexible film wiring board fixed to the support member, having at least one device hole formed therein and having a plurality of inner leads provided therein and extended therefrom;
- and
- at least one semiconductor element substrate with a plurality of electrode pads fixed to the support member, housed in the device hole and mounted by bonding the plurality of extended inner leads to the plurality of electrode pads within the device hole,
- wherein each of the inner leads is bonded to a corresponding one of the electrode pads of the semiconductor element substrate, and each of the inner leads has a small sectional-area portion that has a sectional area smaller than a sectional area of another portion of the inner lead, the small sectional-area portion being arranged in a region between (i) a portion at which the inner lead is bonded to the corresponding electrode pad and (ii) the flexible film wiring board, and being for releasing a stress applied to the bonding portion between the electrode pad and the inner lead.
2 more elements
A semiconductor device comprising:
- a support member;
- a flexible film wiring board fixed to the support member, having at least one device hole formed therein;
- a plurality of inner leads extended from the flexible film wiring board and provided in the device hole;
- and
- at least one semiconductor element substrate with a plurality of electrode pads fixed to the support member, housed in the device hole and connected by bonding the plurality of extended inner leads to the plurality of electrode pads within the device hole,
- wherein each of the inner leads is bonded to a corresponding one of the electrode pads of the semiconductor element substrate, and each of the inner leads has a small sectional-area portion that has a sectional area smaller than a sectional area of another portion of the inner lead, the small sectional-area portion being arranged in a region between (i) a portion at which the inner lead is bonded to the corresponding electrode pad and (ii) the flexible film wiring board.
3 more elements
Dependencies are inferred from the claim text.