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US 7,115,962 B2Granted
Housing for a photoactive semiconductor chip and a method for the production thereof
AssigneeOSRAM Opto Semiconductors GmbH
InventorStefan Grötsch
Life of this patent
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Abstract
In a process for producing a ceramic housing (1), first of all a ceramic base body (4) comprising a ceramic base (2) and side parts (3) is produced. Then, a metal frame (7) is placed onto the ceramic base body (4) and a window (11) is soldered onto a side opening (6). After a photoactive semiconductor chip has been introduced into the ceramic base body (4), the ceramic housing (1) is closed off using a metal cover (12).
Claims15
A process for producing a housing for photoactive semiconductor chips, comprising the steps of:
- providing a trough-shaped ceramic base body defined by sidewalls and having a trough opening, into one side wall of which a side opening is formed from the trough opening;
- forming a securing surface, which surrounds the side opening, for a window by fitting a metal part, which separates the trough opening from the side opening, to the ceramic base body;
- and
- fitting the window to the securing surface.
1 more element
A housing for a photoactive semiconductor chip, comprising:
- a trough-shaped ceramic base body defined by sidewalls and having a trough opening, and a side opening formed in one of said sidewalls;
- a metal part fitted to the ceramic base body and separating the side opening from the trough opening, the metal part together with the ceramic base body forming a securing surface surrounding the side opening;
- and
- a window fitted to the securing surface.
1 more element
Dependencies are inferred from the claim text.