Packaged microelectronic imaging devices and methods of packaging microelectronic imaging devices

A plurality of microelectronic imaging devices, comprising:

• an image substrate including a plurality of dies in and/or on the image substrate, wherein individual dies include an integrated circuit, an image sensor electrically coupled to the integrated circuit, and a plurality of bond-pads electrically coupled to the integrated circuit;
• a cover substrate coupled to the image substrate over the image sensors, the cover substrate being transmissive to radiation for the image sensors;
• and
• a plurality of interconnects in and/or on the cover substrate, the interconnects being arranged in individual arrays corresponding to the bond-pads of individual dies to provide external electrical contacts for the bond-pads of the dies, and wherein each individual interconnect is coupled to a corresponding pair of adjacent bond-pads.

A plurality of microelectronic imaging devices, comprising:

• a microfeature workpiece including a plurality of microelectronic dies, the individual dies having an integrated circuit, an image sensor electrically coupled to the integrated circuit, and a plurality of bond-pads electrically coupled to the integrated circuit;
• a cover substrate over at least one of the image sensors, the cover substrate being transmissive to radiation for the image sensors;
• and
• a plurality of interconnects extending through the cover substrate, each interconnect being electrically coupled to a corresponding pair of adjacent bond-pads.

A microelectronic imaging device, comprising:

• a microelectronic die including an integrated circuit, an image sensor electrically coupled to the integrated circuit, and a plurality of bond-pads electrically coupled to the integrated circuit;
• a cover over the image sensor, the cover being transmissive to radiation for the image sensor and including a plurality of interconnects electrically coupled to corresponding bond-pads;
• a substrate including an opening and a plurality of pads electrically coupled to corresponding interconnects, the cover being disposed between the substrate and the microelectronic die;
• and
• an optics unit disposed at least partially within the opening and aligned with the image sensor.

A microelectronic imaging device, comprising:

• a microelectronic die including an integrated circuit, an image sensor electrically coupled to the integrated circuit, and a plurality of bond-pads electrically coupled to the integrated circuit;
• a cover over the image sensor, the cover being transmissive to visible light;
• a plurality of front side interconnects in and/or on the cover, the interconnects being electrically connected to corresponding bond-pads and having an externally exposed portion;
• a substrate including an opening and a plurality of pads electrically coupled to corresponding interconnects, the cover being disposed between the substrate and the microelectronic die;
• and
• an optics unit disposed at least partially within the opening and aligned with the image sensor.

A microelectronic imaging device comprising:

• a microelectronic die including an integrated circuit, an image sensor electrically coupled to the integrated circuit, and a plurality of bond-pads electrically coupled to the integrated circuit;
• a cover over the image sensor, the cover being transmissive to visible light, wherein the cover includes a first surface, a second surface opposite the first surface, and a plurality of ends connecting the first surface to the second surface;
• and
• a plurality of front side interconnects in and/or on the cover, the interconnects being electrically connected to corresponding bond-pads and having an externally exposed portion, wherein the individual interconnects wrap around one of the ends and extend from the first surface to the second surface.

A microelectronic imaging device, comprising:

• a microelectronic die including an integrated circuit, an image sensor electrically coupled to the integrated circuit, and a plurality of bond-pads electrically coupled to the integrated circuit;
• a cover over the image sensor, the cover including a first surface, a second surface opposite the first surface, and a plurality of interconnects extending from the first surface to the second surface, wherein the interconnects are electrically coupled to corresponding bond-pads;
• a substrate including an opening and a plurality of pads electrically coupled to corresponding interconnects, the cover being disposed between the substrate and the microelectronic die;
• and
• an optics unit disposed at least partially within the opening and aligned with the image sensor.

A microelectronic device, comprising:

• a microelectronic die including an integrated circuit, an image sensor electrically coupled to the integrated circuit, and a plurality of bond-pads electrically coupled to the integrated circuit;
• a cover over the image sensor, the cover including a first surface, a second surface opposite the first surface, and a plurality of interconnects extending from the first surface to the second surface, the interconnects being electrically coupled to corresponding bond-pads;
• a substrate including an opening and a plurality of pads electrically coupled to corresponding interconnects, the cover being disposed between the substrate and the microelectronic die;
• and
• an optics unit disposed at least partially within the opening and aligned with the image sensor.