Capacitor element, manufacturing method therefor, semiconductor device substrate, and semiconductor device
AssigneeShinko Electric Industries Co., Ltd.
InventorsTomoo Yamasaki, Akio Rokugawa
Life of this patent
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Abstract
A capacitor element configured to mount a semiconductor element thereon includes a base. A capacitor part is provided on the base. The base is made of a resin whose coefficient of linear expansion is adjusted in accordance with a coefficient of linear expansion of the semiconductor element mounted on the capacitor element.
Claims14
A capacitor element configured to mount a semiconductor element thereon, said capacitor element comprising:
- a base;
- and
- a capacitor part provided on said base,
- wherein said base is made of a resin whose coefficient of linear expansion is adjusted in accordance with a coefficient of linear expansion of the semiconductor element to fall within a range of 5 to 30 ppm/K.
A combination of a capacitor element and a semiconductor element wherein;
- said capacitor element is configured to mount a semiconductor element thereon;
- said capacitor element comprises a base and a capacitor part provided on said base;
- and
- said base is made of a resin whose coefficient of linear expansion is adjusted in accordance with a coefficient of linear expansion of the semiconductor element that is mounted on the capacitor element.
A semiconductor device substrate on which a semiconductor element having on a substrate may be mounted, said semiconductor device substrate comprising:
- a substrate body having a bottom surface that serves as a mounting surface in which external connection terminals are arranged;
- and
- a capacitor element including:
- a base made of a resin whose coefficient of linear expansion is adjusted in accordance with the semiconductor element to be mounted to a value between a coefficient of linear expansion of the substrate body and a coefficient of linear expansion of the substrate of the semiconductor element;
- a capacitor part including two opposing electrodes and a dielectric layer interposed therebetween;
- a plurality of terminals in a top surface of the capacitor element;
- and
- a plurality of terminals in a bottom surface of the capacitor element, the capacitor element being embedded in the substrate body, a top surface of the capacitor element being exposed at a top surface of the substrate body and serving as a surface on which the semiconductor element may be mounted.
Dependencies are inferred from the claim text.