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US 7,115,911 B2Granted
LED module and method of packaging the same
AssigneeLighthouse Technology Co., Ltd.
InventorsChih-Chin Chang, Teng-Huei Huang, Chien-Lung Lee
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Abstract
An LED module and method of packing the same are provided. The LED module includes a substrate with at least one cavity therein, at least one LED unit positioned on portions of the substrate in the cavity, a circuit positioned above the LED unit and electrically connected to the LED unit, and a first capsulation material filling within the cavity.
Claims20
A light emitting diode (LED) module, comprising:
- a substrate, the substrate comprising at least one cavity;
- at least one LED unit disposed on portions of the substrate in the cavity, wherein the LED unit comprises an LED chip, a thermal conductive layer disposed below the LED chip, an electrical conductive layer electrically connected to the LED chip, and an insulating layer positioned between the electrical conductive layer and the thermal conductive layer;
- a circuit positioned above the LED unit and electrically connected to the LED unit;
- and
- a first capsulation material layer filled within the cavity.
2 more elements
A packaging method of an LED module, comprising:
- providing a substrate, the substrate comprising at least one cavity;
- disposing at feast one LED unit on portions of the substrate in the cavity, wherein the LED unit comprises an LED chip, a thermal conductive layer disposed below the LED chip, an electrical conductive layer electrically connected to the LED chip, and an insulating layer positioned between the electrical conductive layer and the thermal conductive layer;
- soldering a circuit above the LED unit;
- and
- tilling a first capsulation material layer within the cavity.
2 more elements
Dependencies are inferred from the claim text.