Positioning flowable solder for bonding integrated circuit elements
AssigneeMicron Technology, Inc.
InventorBrad D. Rumsey
Life of this patent
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Abstract
A solder mask defined bond pad or a non-solder mask defined bond pad may be configured to center the solder over the bond pad using either surface attractive forces or capillary action. In some embodiments, a stub trace may be provided, for example, in opposition to the real trace to provide a capillary counter-attractive force on the solder. In other embodiments, the surface attractive action of the edge of the solder mask may be utilized to center the solder. In still other embodiments, the natural attractive force of a trace on solder may be utilized to appropriately position solder where desired, for example, to line up with other solder deposits.
Claims12
A bond pad assembly comprising:
- a bond pad;
- a trace that applies an attractive force to solder placed on the pad, said trace coupled to said pad and extending away from said pad in a first direction;
- and
- a trace stub to counteract the attractive force applied by the trace, said trace stub coupled to said pad and extending away from said pad in a direction other than said first direction.
A bonding system comprising:
- a bond pad;
- a trace coupled to said bond pad and extending away from said pad;
- and
- an element adapted to counteract an attractive force applied by the trace to solder placed on the bond pad.
Dependencies are inferred from the claim text.