Heat sink and electromagnetic interference reduction device
AssigneeSun Microsystems, Inc.
InventorsThomas E. Stewart, Steven J. Furuta
Life of this patent
Estimating the term…
Abstract
An electrical assembly comprising a circuit board an electrical device, and a heat dissipation device. The electrical device is capable of emitting thermal energy and electromagnetic interference (EMI). The electrical device is secured to the circuit board. The heat dissipation device is secured to the circuit board and is in thermal communication with the electrical device. The heat dissipation device also includes a continuous EMI fence and a plurality of fins disposed in a matrix orientation. The fins are spaced from one another to allow for efficient heat dissipation and have a substantially square cross-sectional shape.
Claims17
An electrical assembly, comprising:
- a circuit board having at least one aperture formed therein;
- an electrical device secured to the circuit board, wherein a solder ring is on the circuit board and surrounds the electrical device;
- at least one connector;
- and
- an electromagnetic interference (EMI) reduction device being defined by a continuous EMI fence and a cover, the cover being secured to a top surface of the EMI fence and the EMI fence being secured to the circuit board and in contact with the solder ring, wherein at least one connector receiving portion is formed within the EMI reduction device, a bottom of the connector receiving portion being slightly offset from a bottom of the EMI fence, and the at least one connector being interposed within the at least one aperture and received in the at least one connector receiving portion;
- wherein the cover of the EMI reduction device comprises a wire mesh.
An electrical assembly, comprising:
- a circuit board;
- an electrical device capable of emitting thermal energy secured to the circuit board;
- and
- a heat dissipation device secured to the circuit board in thermal communication with the electrical device, the heat dissipation device including a top surface, wherein a plurality of fins extend from the top surface;
- wherein the heat dissipation device includes a bottom surface with an electromagnetic interference (EMI) fence extending from the bottom surface, the EMI fence substantially surrounding the electrical device and being grounded to the circuit board by surface solder using a substantially continuous ring of solder, the solder being in contact with the circuit board and a bottom surface of the EMI fence.
Dependencies are inferred from the claim text.