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US 7,115,510 B2Granted
Method for electrochemically processing a workpiece
AssigneeASM Nutool, Inc.
InventorsBulent M. Basol, Homayoun Talieh, Cyprian E. Uzoh
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Abstract
The present invention relates to a process for forming a near-planar or planar layer of a conducting material, such as copper, on a surface of a workpiece using an ECMPR technique. The process preferably uses at least two separate plating solution chemistries to form a near-planar or planar copper layer on a semiconductor substrate that has features or cavities on its surface.
Claims11
A method of electrochemically processing a surface of a substrate, the surface being conductive and including cavities, comprising:
- forming a conductive layer by depositing a conductive material from a first process solution onto the surface, wherein forming the conductive layer includes electrochemical deposition of the conductive material on the surface and electrochemical mechanical deposition of the conductive material on the surface after the electrochemical deposition, wherein the first process solution comprises a first chemical composition;
- and
- electropolishing the conductive layer using a second process solution.
Dependencies are inferred from the claim text.