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US 7,115,507 B2Granted
Patterning method
AssigneeSeiko Epson Corporation
InventorTakeo Kawase
Life of this patent
Estimating the term…
Abstract
A substrate is patterned by forming an indent region 8 in the surface 10 of a substrate 4 and depositing a liquid material onto the surface 10 at selected locations adjacent to the indent region 8. The liquid material spreads over the surface to an edge of the indent region, at which point further spreading is controlled by the effective enhancement of the contact angle of the liquid material relative to the surface as provided by the indent region.
Claims27
A patterning method, comprising:
- depositing a first liquid material on a substrate surface adjacent to a first side of a plurality of indents formed in the substrate surface;
- and
- depositing a second liquid material on the substrate surface adjacent to a second side of the plurality of indents,
- the first and second sides of the plurality of indents having edges that repel spreading of the first and second liquid materials into the plurality of indents.
1 more element
A patterning method comprising:
- forming an indent region in the surface of a substrate;
- and
- depositing a liquid material onto the surface at selected locations adjacent to the indent region such that spread of the liquid material over the surface is repelled by an edge of the indent region,
- wherein the indent region is formed with a cross-sectional profile to provide a secondary barrier within the indent region to further repel the spread of the material;
- and
- wherein the material is selected to form a semiconductor material and the selected locations are between the indent region and an adjacent indent region so as to provide source and drain regions for a thin film transistor having a channel length determined by a width of the indent region and a channel width determined by a length of the indent region.
3 more elements
A patterning method for depositing a liquid onto a surface of a substrate, said method comprising:
- forming a first and second indent in the surface of the substrate, each indent having falling edges co-incident with the surface and spaced a distance apart, the first and second indents including wall portions sloping relative to the surface, the falling edges repel spreading of the liquid into the indents;
- depositing said liquid between and adjacent to said indents;
- and
- selecting the distance between the falling edges such that a greater volume of liquid is deposited and retained than in the absence of at least one of the indents.
1 more element
A patterning method for depositing a liquid onto a surface of a substrate, said method comprising:
- forming a first and second indent in the surface of the substrate, each indent having falling edges co-incident with the surface and spaced a distance apart, the first and second indents including wall portions sloping relative to the surface, the falling edges repel spreading of the liquid into the indents;
- depositing said liquid between and adjacent to said indents;
- and
- selecting the distance between the falling edges such that a greater contact angle between the liquid and the surface is provided than in the absence of at least one of the indents.
1 more element
A patterning method for depositing a liquid onto a surface of a substrate, said method comprising:
- forming a first and second indent in the surface of the substrate, each indent having falling edges co-incident with the surface and spaced a distance apart, the first and second indents including wall portions sloping relative to the surface, the falling edges repel spreading of the liquid into the indents;
- depositing said liquid between and adjacent to said indents;
- and
- selecting the distance between the falling edges such that a diameter of the deposited liquid is greater than the distance between the falling edges.
1 more element
A patterning method for depositing a liquid onto a surface of a substrate, said method comprising:
- forming a first and second indent in the surface of the substrate, each indent having falling edges co-incident with the surface and spaced a distance apart, the first and second indents including wall portions sloping relative to the surface, the falling edges repel spreading of the liquid into the indents;
- depositing said liquid between and adjacent to said indents;
- and
- selecting the distance between the falling edges such that a thickness of the liquid deposited and retained on the surface of the substrate is greater than in the absence of at least one of the indents.
1 more element
A patterning method, comprising:
- depositing a first liquid material on a substrate surface adjacent to a first side of an indent formed in the substrate surface;
- and
- depositing a second liquid material on the substrate surface adjacent to a second side of the indent,
- each of the first and second sides of the indent having an edge that repels spreading of the first and second liquid materials into the indent,
- the indent having a width tapering towards a bottom.
2 more elements
A patterning method, comprising:
- depositing a first liquid material on a substrate surface adjacent to a first side of an indent formed in the substrate surface;
- and
- depositing a second liquid material on the substrate surface adjacent to a second side of the indent,
- each of the first and second sides of the indent having an edge that repels spreading of the first and second liquid materials into the indent,
- the indent having a width widening towards a bottom.
2 more elements
Dependencies are inferred from the claim text.