Method of forming electrode structure for use in an integrated circuit

A method of making an electrode structure, comprising:

• forming a first layer of metallization;
• forming a dielectric layer on a surface of the first layer;
• forming an opening in the dielectric layer to expose a portion of the surface of the first layer;
• forming an oxide binding layer over the dielectric layer and over the exposed portion of the surface of the first layer, wherein the oxide binding layer being made conductive or at least semi-conductive;
• forming a second layer of metallization on the oxide binding layer;
• annealing the electrode structure to cause metallization from the second layer to diffuse into the binding layer and to provide adhesion between the first and second layers of metallization;
• and
• planarizing the electrode structure by a chemical/mechanical planarization process to form an isolated metallization structure formed in the opening in the dielectric layer.

A method of making an electrode structure, comprising:

• forming a first layer including one of tungsten, nickel and polysilicon;
• forming a dielectric layer on a surface of the first layer;
• forming an opening in the dielectric layer to expose a portion of the surface of the first layer;
• forming a binding layer including a silicon dioxide on the dielectric layer and on the exposed portion of the surface of the first layer;
• forming a second layer including one of silver and nickel on the binding layer;
• annealing the electrode structure at a selected temperature for a predetermined time period to control the chemisorption of silver or nickel into the binding layer, wherein the binding layer is made capable of conducting electrical current;
• and
• planarizing the electrode structure to form a damascene silver layer in the opening.

A method of making an electrode structure, comprising:

• forming a first layer of conductive material;
• forming a dielectric layer on a surface of the first layer;
• forming an opening including a reentrant profile in the dielectric layer to expose a portion of the surface of the first layer;
• forming a conductive binding layer on the dielectric layer and on the exposed portion of the surface of the first layer;
• and
• forming a second layer of conductive material on the conductive binding layer.

A method of making an electrode structure, comprising:

• forming a first layer including one of tungsten, nickel and polysilicon;
• forming a first dielectric layer on a surface of the first layer;
• forming a second dielectric layer on the first dielectric layer, wherein the first dielectric layer has an etch rate faster than the second dielectric layer;
• forming an opening in the first and second dielectric layers to expose a portion of the surface of the first layer, wherein the opening includes a reentrant profile in response to a difference in the etch rate between the first and second dielectric layers;
• forming a binding layer including a silicon dioxide on the second dielectric layer and on the exposed portion of the surface of the first layer;
• forming a second layer including one of silver and nickel on the binding layer;
• annealing the electrode structure at a selected temperature for a predetermined time period to control the chemisorption of silver or nickel into the binding layer;
• and
• planarizing the electrode structure to form a damascene silver layer in the opening.

A method of making a semiconductor die, comprising:

• providing a substrate;
• forming an integrated circuit supported by the substrate;
• and
• forming an electrode coupled to the integrated circuit, wherein forming the electrode includes:
• forming a first layer of conductive material;
• forming a dielectric layer on a surface of the first layer;
• forming an opening in the dielectric layer to expose a portion of the surface of the first layer;
• forming a conductive binding layer over the dielectric layer and over the exposed portion of the surface of the firs layer, wherein the conductive binding layer is formed from an annealed insulating material;
• and
• forming a second layer of conductive material over the conductive binding layer.

A method of making a semiconductor die, comprising:

• providing a substrate;
• forming an integrated circuit supported by the substrate;
• and
• forming an electrode structure associated with the integrated circuit, wherein
• forming the electrode structure includes:
• forming a first layer of metallization;
• forming a dielectric layer on a surface of the first layer;
• forming an opening in the dielectric layer to expose a portion of the surface of the first layer;
• forming an oxide binding layer on the dielectric layer and on the exposed portion of the surface of the first layer;
• forming a second layer of metallization on the binding layer;
• annealing the electrode structure to cause metallization from the second layer to diffuse into the oxide binding layer and to provide adhesion between the first and second layers of metallization, wherein the oxide binding layer is made conductive or at least semi-conductive;
• and
• planarizing the electrode structure by a chemical/mechanical planarization process to form an isolated metallization structure formed in the opening in the dielectric layer.

A method of making a semiconductor die, comprising:

• providing a substrate;
• forming an integrated circuit supported by the substrate;
• and
• forming an electrode structure associated with the integrated circuit, wherein forming the electrode structure includes:
• forming a first layer including one of tungsten, nickel and polysilicon;
• forming a dielectric layer on a surface of the first layer;
• forming an opening in the dielectric layer to expose a portion of the surface of the first layer;
• forming an oxide binding layer including a silicon dioxide on the dielectric layer and on the exposed portion of the surface of the first layer;
• a second layer including one of silver and nickel on the binding layer;
• annealing the electrode structure at a selected temperature for a predetermined time period to control the chemisorption of silver or nickel into the oxide binding layer, wherein the oxide binding layer is made conductive or at least semi-conductive;
• and
• planarizing the electrode structure to form a damascene silver layer in the opening.

A method of making a semiconductor die, comprising:

• providing a substrate;
• forming an integrated circuit supported by the substrate;
• and
• forming an electrode coupled to the integrated circuit, wherein forming the electrode includes:
• forming a first layer of conductive material;
• forming an oxide binding layer on a surface of said first layer, wherein the oxide binding layer being made conductive or at least semiconductive;
• and
• forming a second layer of conductive material on the binding layer.