Method for protecting the redistribution layer on wafers/chips
AssigneeInfineon Technologies AG
InventorsAxel Brintzinger, Octavio Trovarelli
Life of this patent
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Abstract
The invention relates to a method for protecting the redistribution layer on wafers/chips, which preferably comprises a structure constructed from a seed layer, a layer of copper situated on the seed layer, a nickel layer arranged thereon, and a gold layer covering the latter. The wafer (4) provided with the redistribution layer (1) is covered on its entire surface with an organic protective layer (12), e.g., made of BTA (benzotriazole), Glicoat or Preventol®, which protects the redistribution layer (1) from corrosion and oxidation in that it produces a dense covering of the metal surface of the redistribution layer (1) through chemical bonding.
Claims26
A method for protecting a redistribution layer on a wafer, wherein the wafer provided with the redistribution layer is covered on its entire surface with an organic protective layer, which protects the redistribution layer from corrosion and oxidation in that it produces a dense covering of the metal surface of the redistribution layer through chemical bonding, wherein the wafer is etched prior to the coating with the organic protective layer.
A method for manufacturing a semiconductor device, the method comprising:
- providing a semiconductor device that includes a conductive area at an upper surface;
- forming a redistribution layer on the semiconductor device, the redistribution layer electrically coupling the conductive area to a connection region;
- coating the redistribution layer with an organic protective layer, wherein the semiconductor device is etched prior to the coating with the organic protective layer.
A method for manufacturing a semiconductor device, the method comprising:
- providing a semiconductor device that includes a conductive area at an upper surface;
- forming a redistribution layer on the semiconductor device, the redistribution layer electrically coupling the conductive area to a connection region;
- coating the redistribution layer with an organic protective layer;
- mounting the semiconductor device on a carrier;
- and
- repeating the coating of the semiconductor device after the semiconductor device has been mounted on the carrier.
A method for manufacturing a semiconductor device, the method comprising:
- providing a semiconductor device that includes a conductive area at an upper surface;
- forming a redistribution layer on the semiconductor device, the redistribution layer electrically coupling the conductive area to a connection region;
- coating the redistribution layer and the connection region with an organic protective layer;
- and
- performing a soldering operation at the connection area, wherein the soldering operation removes the organic protective layer from the connection area so that solder material adheres on the connection region.
Dependencies are inferred from the claim text.