Method of dicing a wafer
AssigneeAdvanced Semiconductor Engineering, Inc.
InventorYao-Hsin Feng
Life of this patent
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Abstract
A method of dicing a wafer is disclosed. A wafer with an active surface and a back surface is provided. Prior to dicing the wafer, a removable layer is formed on the back surface of the wafer. The removable layer is attached to a tape, such as a sawing tape. After the wafer is singulated and the adhesion of the removable layer is reduced or removed, the separate chips singulated from the wafer are easily removed from the tape. Because of the removable layer attached on the back surface of the wafer, the cutting stress caused by singulating the wafer will be transferred without concentrated at the back surface of the wafer so as to prevent the wafer from chipping and being warped.
Claims13
A method of dicing a wafer, the method comprising the steps of:
- providing the wafer having a back surface and an active surface opposing to the back surface;
- forming a removable layer on the back surface of the wafer, wherein the removable layer is attached to the back surface impermanently;
- disposing a tape on the removable layer;
- singulating the wafer, the removable layer and the tape to separate the wafer and the removable layer into a plurality of separate chips and a plurality of separately removable layers, and to partially separate the tape to form a partially separate tape, wherein the separate chips are connected to the partially separate tape through the separately removable layers, wherein the removable layer has a thickness for preventing the wafer from chipping;
- and
- removing the separate chips from the separated removable layers.
Dependencies are inferred from the claim text.