Method of manufacturing semiconductor device

A method of manufacturing semiconductor device including steps of:

• adhering an adhesive tape to a back surface of a semiconductor wafer formed with integrated circuits over a main surface thereof, and thereafter dicing the semiconductor wafer to thereby divide the semiconductor wafer into a plurality of semiconductor chips;
• and
• applying an upward load and vibration to the adhesive tape below the semiconductor chip which becomes an object to be peeled off, among the plurality of semiconductor chips adhered to the adhesive tape, in a state that an upper surface of the semiconductor chip which becomes an object to be peeled off is sucked and held by a collet, to thereby peel off the semiconductor chip from the adhesive tape,
• wherein the step of applying the load and the vibration to the adhesive tape includes:
• a step of preparing a first pusher block having a first upper surface and a corner portion around the first upper surface, and a second pusher block having a second upper surface which is arranged inside the first upper surface, a corner portion around the second upper surface, and vibration means;
• a first step of pushing the adhesive tape upwardly by making the first and second upper surfaces simultaneously push up the back surface of the adhesive tape;
• a second step of applying the vibration to the adhesive tape by vibrating the second pusher block after the first step or simultaneously with the first step;
• and
• a third step of further pushing the adhesive tape upwardly by pushing up the second upper surface higher than the first upper surface while vibrating the second pusher block after the second step.