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US 7,115,444 B2Granted
Semiconductor device with improved heat dissipation, and a method of making semiconductor device
AssigneeFujitsu Limited
InventorHideaki Yoshimura
Life of this patent
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Abstract
A semiconductor device includes a semiconductor chip, a heat dissipation member for dissipating heat generated by the semiconductor chip, and a coupling member which thermally couples the semiconductor chip to the heat dissipation member, wherein the coupling member is made of metal and deformable to absorb a stress generated between the semiconductor chip and the heat dissipation member, the coupling member and the semiconductor chip being joined through metal-metal bonding.
Claims1
A method of making a semiconductor device, comprising the steps of:
- making a coupling member by forming posts on a substrate;
- forming a metal layer on a back surface of a semiconductor chip;
- pressing said posts against said metal layer while filling a resin material between said coupling member and said semiconductor chip, thereby joining said posts to said metal layer through metal-metal bonding.
Dependencies are inferred from the claim text.