Manufacturing method for wiring substrates
AssigneeNgk Spark Plug Co., Ltd.
InventorShinji Yuri
Life of this patent
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Abstract
A manufacturing method for wiring substrates for photographing a positioning mark formed with a high precision using reflected light and executing a relative positioning operation between a wiring substrate workpiece and an exposure mask based thereon. The method steps include successively laminating a conductor layer and dielectric layer on a plate-like core and forming a positioning mark by irradiating the main surface of dielectric layer with laser light. By irradiating the positioning mark with position detecting light from the side of the main surface of the dielectric layer and detecting reflected light, relative positioning between the wiring substrate workpiece and the exposure mask is based on the detection result.
Claims6
A method for manufacturing a wiring substrate including a wiring integrated portion in which a resin dielectric layer and a conductor layer are alternately laminated, said manufacturing method comprising steps of:
- laminating said conductor layer and said resin dielectric layer on a supporting substrate with an outermost dielectric layer;
- forming a positioning mark, using an irradiating laser, on a main surface of said resin dielectric layer;
- and
- irradiating said positioning mark with light from the main surface side of said resin dielectric layer and detecting light reflected from said main surface, and
- identifying a position of a wiring substrate workpiece based on said detecting of light reflected from said surface,
- wherein in the step of forming the positioning mark, said irradiating laser is projected onto a selected excavation area by shifting the laser irradiation in position so as to provide overlapping in a circumferential direction and in a radial direction to produce a ring-like excavation area forming said positioning mark, the positioning mark comprising a groove produced by removing an annular portion of said resin dielectric layer so as to expose said conductor layer within the groove.
A method of manufacturing a wiring substrate including a wiring integrated portion in which a resin dielectric layer and a conductor layer are alternately laminated, said method comprising the steps of:
- laminating said conductor layer and said resin dielectric layer on a supporting substrate with an outermost dielectric layer, said resin layer having a main surface;
- forming a positioning mark by removing a portion of said resin dielectric layer to form a groove;
- and
- irradiating said positioning mark with position detecting light projected onto the main surface of said resin dielectric layer so that light is reflected therefrom and
- detecting reflected light and identifying a position of a wiring substrate workpiece based on the reflected light detected,
- wherein, in the step of identifying the position of the wiring substrate workpiece, a camera for detecting said reflected light is focused on the main surface of said resin dielectric layer so as to recognize ends defining the groove of said positioning mark.
Dependencies are inferred from the claim text.