Base pattern forming material for electrode and wiring material absorption, electrode and wiring forming method, and method of manufacturing image forming apparatus

A method of manufacturing an image-forming apparatus including a plurality of electron-emitting devices and an image-forming member for forming an image by irradiation of electron beams emitted from the electron-emitting devices, comprising:

• forming said plurality of electron-emitting devices and said image-forming member,
• wherein at least one of an electrode and a wiring is formed by the method comprising:
• a step of applying on a substrate a photosensitive resin containing a water-soluble photosensitive resin component and a water-soluble metallic compound;
• a step of exposing the applied photosensitive resin;
• a step of developing the exposed photosensitive resin to form on the substrate a base pattern containing at least the water-soluble metallic compound;
• an absorbing step of absorbing an organic metallic compound containing a metal different from that in the water-soluble metallic compound into the base pattern;
• and
• a baking step of baking the base pattern in which the organic metallic compound is absorbed at a temperature from 400° C. to 600° C.

An electroconductive member forming method, comprising:

• a step of forming on a substrate a precursor pattern of the electroconductive member containing at least a metallic compound;
• a step of absorbing an organic metallic compound containing a metal different from that in the metallic compound into the precursor pattern;
• and
• a step of baking the precursor pattern that absorbed the organic metallic compound.

An electrode and wiring forming method, comprising:

• a step of forming on a substrate a precursor pattern of the electrode and wiring containing at least a metallic compound;
• a step of absorbing an organic metallic compound containing a metal different from that in the metallic compound into the precursor pattern;
• and
• a step of baking the precursor pattern that absorbed the organic metallic compound to form the electrode and wiring.