Low temperature method and composition for producing electrical conductors
AssigneeParelec, Inc.
InventorsPaul H. Kydd, Gregory A. Jablonski, David L. Richard
Life of this patent
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Abstract
A composition of matter having a metal powder or powders of specified characteristics in a Reactive Organic Medium (ROM). These compositions can be applied by any convenient printing process to produce patterns of electrical conductors on temperature-sensitive electronic substrates. The pattern can be thermally cured in seconds to form pure metal conductors at a temperature low enough to avoid damaging the substrate.
Claims18
A composition of matter comprising a reactive organic medium and a metal powder mixture, wherein the reactive organic medium reacts with said metal powder mixture to decompose at a temperature below about 450° C. and said metal powder mixture comprises:
- (a) metal powder particles having a diameter of 0.6 micrometers to less than about 50 micrometers;
- and
- (b) metal particles having a diameter of less than 0.6 micrometers, wherein said metal powder mixture does not contain metallic flakes.
A composition of matter comprising a reactive organic medium and a metal powder mixture, wherein the reactive organic medium reacts with said metal powder mixture to decompose at a temperature below about 450° C. and said metal powder mixture comprises:
- (a) 50–85% by weight of metal powder particles, wherein the diameter of the metal powder particles is from 0.3 micrometers to about 1.0 micrometers, and
- (b) 15–50% by weight of metal particles, wherein the diameter of the metal powder particles is less than 0.3 micrometers,
- wherein said metal powder mixture does not contain metallic flakes.
A composition of matter comprising a reactive organic medium and a metal powder mixture, wherein the reactive organic medium reacts with said metal powder mixture to decompose at a temperature below about 450° C. and said metal powder mixture comprises:
- about 50% by weight of metal powder particles, wherein the diameter of the metal powder particles is from 1.0 micrometers to about 1.0 micrometers:
- about 30% by weight of metal powder particles, wherein the diameter of the metal powder particles is from 0.3 micrometers to 1.0 micrometers;
- and
- about 20% by weight of metal particles, wherein the diameter of the metal particles is less than 0.3 micrometers,
- wherein said metal powder mixture does not contain metallic flakes.
A composition of matter comprising a reactive organic medium and a metal powder mixture, wherein the reactive organic medium reacts with said metal powder mixture to decompose at a temperature below about 450° C. and said metal powder comprises:
- about 15% by weight of metal powder particles, wherein the diameter of the metal powder particles is from 2.0 micrometers to about 50 micrometers:
- about 40% by weight of metal powder particles, wherein the diameter of the metal powder particles is from about 1.0 micrometers to about 10 micrometers;
- and
- about 15% by weight of metal powder particles, wherein the diameter of the metal powder particles is from 0.3 micrometers to 1.0 micrometers, and
- about 30% by weight of metal particles, wherein the diameter of the metal particles is less than 0.3 micrometers,
- wherein said metal powder mixture does not contain metallic flakes.
A method for producing solid pure metal conductors on a substrate comprising the steps of:
- A) applying a conductor precursor in a pattern on to the substrate;
- B) heating said substrate with said patterned precursor in an oven to a critical temperature less than about 450° C. for a time less than about five minutes;
- wherein said applied conductor precursor pattern is converted into a consolidated, bonded pure metal conductor
- wherein said conductor precursor is comprised of a reactive organic medium and a metal powder mixture, wherein said metal powder mixture comprises:
- metal powder particles having a diameter of 0.6 micrometers to less than about 50 micrometers;
- and
- metal particles having a diameter of less than 0.6 micrometers, wherein said metal powder mixture does not contain metallic flakes.
Dependencies are inferred from the claim text.